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Image sensor with anti-reflection layer and method of manufacturing the same

一种图像传感器、抗反射层的技术,应用在图像传感器领域,能够解决图像传感器制造工艺复杂、昂贵等问题,达到改善可靠性、降低故障率、降低制造成本的效果

Active Publication Date: 2020-02-28
SK HYNIX INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the image sensor manufacturing process is complex and expensive

Method used

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  • Image sensor with anti-reflection layer and method of manufacturing the same
  • Image sensor with anti-reflection layer and method of manufacturing the same
  • Image sensor with anti-reflection layer and method of manufacturing the same

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Embodiment Construction

[0027] Hereinafter, an image sensor having an anti-reflection layer and a method of manufacturing the same will be described through various examples of embodiments with reference to the accompanying drawings.

[0028] figure 1 is a plan view illustrating a pixel array region 101 provided in an image sensor according to an embodiment. see figure 1 , the pixel array area 101 is divided into an active pixel array area 111 and an optical black pixel array area 121 . The active pixel array region 111 and the optical black pixel array region 121 are adjacent to each other.

[0029] The pixel array consists of a plurality of pixels (see figure 2 and image 3 212 and 213). For example, a plurality of light sensing elements are disposed in the active pixel array area 111 and the optical black pixel array area 121 . The optical sensing element may be a phototransistor, a photodiode, a photogate, a pinned photodiode, or the like. A plurality of light sensing elements may be arra...

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Abstract

An image sensor, comprising: a pixel layer in which an active pixel array and an optical black pixel array are formed; a first anti-reflective layer formed on the active pixel array and including a first oxide layer with high light transmittance a hafnium layer; and a second anti-reflective layer formed over the optical black pixel array and including a second hafnium oxide layer with low light transmittance.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2014-0124295 filed with the Korean Intellectual Property Office on September 18, 2014, the entire contents of which are hereby incorporated by reference. technical field [0003] Various embodiments relate generally to image sensors, and more particularly to image sensors configured by complementary metal oxide semiconductors (CMOS) and methods of fabricating the same. Background technique [0004] The image sensor senses an external image as light, converts the sensed light into an electrical signal, and transmits the electrical signal to a device that processes the digital signal. In general, there are two types of image sensors, a Charge Coupled Device (CCD) image sensor and a Complementary Metal Oxide Semiconductor (CMOS) image sensor. [0005] The CCD image sensor includes a photodiode, a CCD, and a signal detection circuit formed on a P-type ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/14623H01L27/1462H01L27/14685H01L27/14627H01L27/14621
Inventor 金都焕孙贤哲罗喜途兪景东金锺采
Owner SK HYNIX INC