A binding method and binding device

Abstract

The invention relates to the technical field of display and discloses a binding method and a binding device. The binding method comprises the steps that downward motion of a hot-pressing head located above a driving chip attaching an array substrate through an adhesive is controlled till the hot-pressing head is in contact with the driving chip and exerts pressure on the driving chip; upward motion of a heating carrier table arranged below the array substrate is controlled till the heating carrier table is in contact with the array substrate; the contact between the heating carrier table and the array substrate is not later than the contact between the hot-pressing head and the driving chip, and the temperature of the heating carrier table when the heating carrier table is in contact with the array substrate is the temperature of the array substrate when the driving chip and the array substrate have the same thermal expansion amount, so that the driving chip and the array substrate have the same thermal expansion amount. Also, due to the fact that the contact between the heating carrier table and the array substrate is not later than the contact between the hot-pressing head and the driving chip, array substrate damage is avoided. In addition, before binding, the heating carrier table is not always in contact with the array substrate, advanced curing of a bonding agent is avoided, and the product yield is improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a binding method and a binding device. Background technique [0002] In the field of display technology, COG refers to binding the IC (driver chip) to the array substrate of the LCD (liquid crystal panel) through the binder ACF (Anisotropic Conductive Film), and COG can greatly reduce the size of the LCD module. Small in size and easy to mass-produce, it has become the main connection method for ICs and LCDs. [0003] Such as figure 1 As shown, the current binding device for realizing COG includes a heating base 07 and a thermal pressing head 02 which are arranged oppositely. The heating base 07 is fixedly arranged, and the thermal pressing head is driven by the cylinder 01. There is a buffer material 05 on 02. Before the bonding process starts, the array substrate 06 is moved to the heating base 07 in advance, waiting for the thermal head 02 to press down. During this...

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Problems solved by technology

[0003] like figure 1 As shown, the current binding device for realizing COG includes a heating base 07 and a thermal pressing head 02 which are arranged oppositely. The heating base 07 is fixedly arranged, and the thermal pressing head is driven by the cylinder 01. There is a buffer material 05 on 02. Before the bonding process starts, the array substrate 06 is moved to the heating base 07 in advance, waiting for the thermal head 02 to press down. During this time, ACF03 is always in a heated state. In order to prevent ACF03 from curing in advance At this time, the temperature of the heating base 07 cannot be set too high (>100°C). During the binding process, the cylinder 01 drives the thermal head 02 to move down and puts pressure on IC04. The cooperation of IC04 is bound to the array substrate 06, and because in the binding process, such as figure 2 As shown, at the reaction temperature of ACF03170°C, the actual temperature of IC04 is 210°C, the actual temperature of array substrate 06 is 110°C, and the temperature difference is 100°C, resulting in the expansion length of IC04 being greater than the expansion length of array substrate 06, and then cooling The shrinkage of IC04 is greater than that of array substrate 06, resulting in bending deformation, resulting in COG Mura (uneven color tone), affecting the liquid crystal deflection inside the LCD panel, and thus affecting the quality of the LCD screen

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