Stepping cutting device

Abstract

The invention discloses a step type cutting device. The step type cutting device comprises a machine frame and a diamond wire. The machine frame is provided with a driving roller and a driven roller which are opposite, the diamond wire is wound around the driving roller and the driven roller, and a base is connected to the machine frame in a sliding manner; a fixing rod is fixedly connected to the base, the driving roller is rotationally connected to the top of the fixing rod, and a supporting rod is connected to the base in a sliding manner; the driven roller is arranged at the top of the supporting rod, a rack is connected to the supporting rod and meshed with a gear, the gear is rotationally connected to the machine frame; a rotation disc is rotationally connected to the machine frame, a connecting rod is hinged to the rotation disc, and one side, along the sliding direction of the base is hinged to the connecting rod; a gripping jaw is arranged above the diamond wire, and a pushing rod is connected to the gripping jaw and connected to the machine frame in a sliding manner; through matching of the gear and the rack, the tension degree of the diamond wire can be conveniently adjusted; and through the arrangement of the rotation disc and the connecting rod, the diamond wire can rotate at a high speed while moving in a reciprocated manner, and therefore polycrystalline silicon can be cut by the diamond wire more easily, and the cutting efficiency is improved accordingly.

Description

technical field [0001] The invention relates to a cutting device, in particular to a step-by-step cutting device. Background technique [0002] Many things in the industry are cut with diamond wire, such as polysilicon slices in the photovoltaic field. The material of the diamond wire is important. At present, the mainstream silicon wafer cutting wire used in the photovoltaic field is an ultra-fine cutting steel wire with a diameter of about 100 microns. As the name suggests, diamond wire is related to diamond. It is generally a diamond cutting wire made of tiny diamond particles embedded on the wire; we know that diamond is a superhard and widely used cutting material. Serrated teeth, which increase the cutting ability of the steel wire, can greatly speed up the cutting speed. [0003] When using cutting wire to cut polysilicon, the diamond wire is first fixed on the reciprocating cutting device. The reciprocating cutting device includes a frame, and two rollers are fixe...

AI Technical Summary

Problems solved by technology

[0004] The problems of the above devices are: 1. When installing the diamond wire, because the distance between the two rollers cannot be adjusted, it is impossible to ensure that the installed diamond wire is at a high tension; When cutting polysilicon, the diamond wire cutting strength cannot be guaranteed, which will lengthen the cutting time and affect the cutting efficiency

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