Unlock instant, AI-driven research and patent intelligence for your innovation.

Baking apparatus and method

A technology of baking device and contact position, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve the problem of unsatisfactory photoresist development

Active Publication Date: 2016-12-07
TAIWAN SEMICON MFG CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Now, these developed patterns have very fine details and during the photolithography process, some issues can cause undesired defects in the developed photoresist
[0004] Although existing devices for lithographic setups are generally adequate for their intended purpose, these approaches are not fully satisfactory in all respects

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Baking apparatus and method
  • Baking apparatus and method
  • Baking apparatus and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include embodiments in which the first component and the second component are formed in direct contact, and may also include embodiments in which the first component and the second component may be formed in direct contact. An embodiment in which an additional part is formed so that the first part and the second part may not be in direct contact. In addition, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for the sake of simplicity and clarity and does not in itself indicate a relations...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A baking apparatus for baking a wafer is provided. The baking apparatus includes a wafer chuck configured to hold the wafer, and a heating device disposed over the wafer chuck and configured to heat the wafer. The baking apparatus also includes a carrying arm configured to transport the wafer over the wafer chuck. The wafer chuck is in physical contact with the center area of the bottom surface of the wafer when the wafer is held by the wafer chuck. The embodiment of the invention relates to the baking apparatus and method.

Description

technical field [0001] Embodiments of the invention relate to a baking device and method. Background technique [0002] Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. Semiconductor devices are typically fabricated by sequentially depositing an insulating or dielectric layer, a conductive layer, and a layer of semiconducting material over a wafer; and patterning each material layer using a photolithographic process to form circuit components on each material layer and components. Many integrated circuits are typically fabricated on a single wafer, and the individual dies on the wafer are singulated by sawing between the integrated circuits along scribe lines. For example, individual dies are typically packaged separately in multi-chip modules or in other packaging types. [0003] In the photolithography process, a photoresist is applied to the wafer. A thin l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/3105
CPCH01L21/31058H01L21/67115H01L21/67109H01L21/6719H01L21/68764H01L21/68H01L21/687
Inventor 杨青海李尚昇高耀寰
Owner TAIWAN SEMICON MFG CO LTD