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Devices including sensors protected by resin

A sensor and resin technology, applied in the direction of measuring devices, measuring device casings, instruments, etc., can solve the problems of resin should not be covered, oxidized, shortened service life, etc.

Active Publication Date: 2019-08-20
SC2N SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when an electronic component includes a sensor whose sensitive element must be exposed to the environment of the electronic component, the resin should not cover the sensitive element
[0004] However, perhaps under the effect of temperature or pressure changes, cracks may develop in the resin, risking the contact of electronic parts with the external environment
Solders or traces of electronic components may thus become oxidized, which shortens their service life

Method used

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  • Devices including sensors protected by resin
  • Devices including sensors protected by resin
  • Devices including sensors protected by resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The term "comprising a" or "comprising a" means "comprising at least one", unless stated otherwise.

[0028] Unless otherwise indicated, "resin" is in the solid state.

[0029] figure 1 An example of a device according to the invention is shown. The device comprises a housing 10 defining a substantially closed cavity 12 filled with a resin 14 . The dashed line indicates the upper level of the resin. The housing 10 includes side walls 16 , a bottom 18 and a dome 20 .

[0030] The side walls 16 and / or the bottom 18, or even the housing 10, are preferably made of a plastic material, preferably chosen among thermoplastics.

[0031] The dome is pierced with fill holes 22 and vent holes 24 .

[0032] A plot 30 protrudes from the base 18 .

[0033] The electronic component 32 includes a sensor 34 disposed over the bump 30 . The electronic component 32 is immersed in the resin 14 with the exception of the sensitive element 36 of the sensor 34, from which the sensitive el...

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PUM

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Abstract

The invention relates to a device comprising: - a housing (10) comprising side walls and a bottom (18) to define a cavity (12); - a resin (14) filling said cavity to immerse electronic components, At the same time, the sensitive element is exposed; - the electronic component (32), which includes a sensor (34) provided with a sensitive element (36); - the electronic component is placed on at least On a bump (30) to prevent the formation of air bubbles in the resin, said bump is spaced apart from or in contact with said side wall (16) at a distance d greater than 1 mm.

Description

technical field [0001] The invention relates to a device comprising a housing in which a sensor partially immersed in resin is arranged. Background technique [0002] In automotive applications, certain electronic components must be protected to increase their useful life. For this purpose, it is known to place them in a housing, which is then filled with a liquid resin which, by hardening, protects them from the external environment. [0003] However, when the electronic component includes a sensor whose sensitive element must be exposed to the environment of the electronic component, the resin should not cover the sensitive element. [0004] However, perhaps under the effect of temperature or pressure changes, cracks may develop in the resin, risking the electronic components from coming into contact with the external environment. Solders or tracks of electronic components may thus become oxidized, which shortens their service life. [0005] There is a need for devices ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01D11/24B29C33/12B29C39/10G01L19/14
CPCB29C39/10G01L19/147B29C33/126G01L19/0672G01D11/245B29K2063/00B29K2075/00B29K2083/00B29K2995/0016B29K2995/0086B29L2031/3425H05K1/18H05K2201/10151
Inventor M.格罗尼耶O.格冈D.格拉瓦特
Owner SC2N SA