A grabbing device for an integrated circuit board carrying box
A technology for integrated circuit boards and grabbing devices, which is applied to circuits, electrical components, transportation and packaging, etc. It can solve the problems of reducing production efficiency, wasting labor, and difficulty in meeting industrialized production, so as to improve work efficiency and avoid large-scale labor the effect of using
Active Publication Date: 2018-12-07
徐州晶迪电子有限公司
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Problems solved by technology
[0003] On the packaging line, the integrated circuit boards from the previous process are loaded into the carrier box, output through the output device, and transported to the packaging workers. Considering the differences in the setting positions and heights of different process production lines, manual packaging is required. Carrier boxes are moved from one conveyor line to another, which reduces production efficiency, wastes labor, and is difficult to meet the requirements of industrial production
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[0017] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0018] Such as Figure 1-4 As shown, the grasping device of the integrated circuit board carrier box includes a conveying mechanism 1, a grasping mechanism 2 and a control mechanism. The grasping mechanism 2 is located directly above the conveying mechanism 1, and the conveying mechanism 1 is transported with a carrier box loaded with integrated circuit boards. 3. The carrier box 3 includes a box body 30 with an opening on the top. A plurality of partition plates are arranged inside the box body 30. Each partition plate includes a protruding part 33 and a recessed part 32. The recessed part 32 is coated with an elastic layer. Two opposite spacers form a storage space, and the opposite side of the box body 30 is provided with a grasping...
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The invention discloses a gripping device for integrated circuit board carrying box, which comprises a transmission mechanism, a gripping mechanism and a control mechanism. The gripping mechanism is located right on the transmission mechanism. The transmission mechanism is provided with an integrated circuit board carrying box. The upper part of the carrying box is provided with a box body with an opening. Inside the box body is mounted a plurality of partition plates. Each partition plate comprises a protruding part and an indented part. The indented part is coated with an elastic layer. Two oppositely arranged partition plates form accommodation space. The relative side edges of the box body are provided with gripping support plates. The gripping mechanism and the transmission mechanism are both electrically connected with the control mechanism. The gripping mechanism comprises a fixed plate. A first inverted T type guide rail is formed at the lower part of the fixed plate. The first inverted T type guide rail is provided with a sliding block in a sliding manner. A second inverted T type guide rail is formed at the lower part of the sliding block. According to the invention, it is possible to safely and effectively grip and transport carrying boxes from different transportation lines, therefore, increasing the working efficiency and avoiding the use of massive labor force.
Description
Technical field: [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a grabbing device for an integrated circuit board carrying box. Background technique: [0002] The integrated circuit is a new technology that emerged in the late 1950s. It uses a certain process to connect components such as transistors, resistors, capacitors, and inductors. In order to ensure integrity and sealing, the integrated circuit is also packaged. The board is encapsulated within a microstructure. In the field of science and technology, all kinds of technology products need to be light, thin, and short. The smaller the size of the integrated circuit, the better, so that it can meet the needs of the product. Therefore, a packaging technology with the same size as the chip can reduce the volume of the integrated circuit after packaging, so as to meet the requirements of thinness, lightness and compactness. [0003] On the packaging line, the integr...
Claims
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67121H01L21/67703H01L21/67706H01L21/6773H01L21/67736
Inventor 李风浪李舒歆
Owner 徐州晶迪电子有限公司