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PCB electroplating device

A technology of PCB board and electroplating device, which is applied in the field of electroplating device, can solve problems such as the quality of electroplating that is easy to fall into the tank, the difficulty of mixing the electroplating solution evenly, and the unstable clamping of PCB board, so as to enhance efficiency, reduce dead angle, The effect of increasing range

Active Publication Date: 2017-01-18
成都展讯通信技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a PCB board electroplating device to solve the problems of the prior art that the electroplating solution for electroplating PCB boards is difficult to mix evenly, and the PCB board is not clamped stably and easily falls into the tank, which causes the electroplating quality and efficiency to drop.

Method used

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  • PCB electroplating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Figure 1 to Figure 3 The PCB board electroplating device 1 provided for the present invention includes a tank body 1 and a PCB board clamping device, wherein,

[0033] The bottom of tank body 1 is provided with liquid spray pipe 4 around, and the upper part of tank body 1 is provided with liquid suction pipe 2 close to the side wall. The liquid suction pipe 2 is connected, the outlet of the water pump 3 is connected with the liquid spray pipe 4, and the surfaces of the liquid suction pipe 2 and the liquid spray pipe 4 are all provided with round holes 43;

[0034] The liquid spray pipe 4 includes a connecting part 41 and a rotating part 42, the middle part of the connecting part 41 is fixedly connected to the outlet of the water pump 3, and the two ends of the connecting part 41 are respectively connected to the rotating part 42 in rotation;

[0035] One end of the rotating part 42 connected to the connecting part 41 is bent inwardly to form a bending part, the connec...

Embodiment 2

[0039] Figure 1 to Figure 3 The PCB board electroplating device 1 provided for the present invention includes a tank body 1 and a PCB board clamping device, wherein,

[0040] The bottom of tank body 1 is provided with liquid spray pipe 4 around, and the upper part of tank body 1 is provided with liquid suction pipe 2 close to the side wall. The liquid suction pipe 2 is connected, the outlet of the water pump 3 is connected with the liquid spray pipe 4, and the surfaces of the liquid suction pipe 2 and the liquid spray pipe 4 are all provided with round holes 43;

[0041] The spray pipe 4 includes a connecting part 41 and a rotating part 42, the middle part of the connecting part 41 is fixedly connected to the outlet of the water pump 3, and the two ends of the connecting part 41 are respectively connected to the rotating part 42 in rotation;

[0042] One end of the rotating part 42 connected to the connecting part 41 is bent inwardly to form a bending part, the connecting pa...

Embodiment 3

[0048] Figure 1 to Figure 3 The PCB board electroplating device 1 provided for the present invention includes a tank body 1 and a PCB board clamping device, wherein,

[0049] The bottom of tank body 1 is provided with liquid spray pipe 4 around, and the upper part of tank body 1 is provided with liquid suction pipe 2 close to the side wall. The liquid suction pipe 2 is connected, the outlet of the water pump 3 is connected with the liquid spray pipe 4, and the surfaces of the liquid suction pipe 2 and the liquid spray pipe 4 are all provided with round holes 43;

[0050] The liquid spray pipe 4 includes a connecting part 41 and a rotating part 42, the middle part of the connecting part 41 is fixedly connected to the outlet of the water pump 3, and the two ends of the connecting part 41 are respectively connected to the rotating part 42 in rotation;

[0051] One end of the rotating part 42 connected to the connecting part 41 is bent inwardly to form a bending part, the connec...

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Abstract

The invention discloses a PCB electroplating device. The PCB electroplating device comprises a trough body and a PCB clamping device. Liquid spraying pipes are arranged around the bottom of the trough body. Liquid sucking pipes close to the side wall are arranged on the upper portion of the trough body. Water pumps are arranged between the liquid sucking pipes and the liquid spraying pipes. Inlets of the water pumps are connected with the liquid sucking pipes. Outlets of the water pumps are connected with the liquid spraying pipes. The surfaces of the liquid sucking pipes and the surfaces of the liquid spraying pipes are all provided with round holes. The top of the trough body is connected with a support. A brace rod of the support is provided with two tripods. The top ends of the tripods are fixedly connected with the brace rod. Two or more clamping plates parallel in the vertical direction are fixed under each tripod at an equally-spaced mode. Every two adjacent clamping plates are a set. The two ends of the two clamping plates in the same horizontal plane in each set are connected correspondingly through springs. According to the trough body of the PCB electroplating device, the efficiency of mixing of an electrolyte is improved through the arrangement of the liquid sucking pipes and the liquid spraying pipes. The clamping plates of the PCB clamping device are connected through the springs so that pcbs can be clamped conveniently, the clamping plates can also be used for clamping different-dimension pcbs, and thus the cost is also lowered while time and labor are saved.

Description

technical field [0001] The invention relates to an electroplating device, in particular to a PCB board electroplating device. Background technique [0002] The PCB board is a printed circuit board, also known as a printed circuit board, a printed circuit board, or a printed board for short. It is an important electronic component and a support for electronic components. Its processing quality and efficiency are crucial. There are two important problems in the electroplating step of the existing PCB board production, one is that the electrolyte is not mixed evenly, which has a great impact on the quality of the produced PCB board; the other is that the PCB board clamping device is not firmly clamped, It is easy to drop the board, and there may be problems with the plating time and quality of the dropped PCB board, which not only affects the quality of the PCB board product, but also affects the production efficiency and increases the cost. Therefore, the solution of these two...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/10C25D17/06C25D17/02
CPCC25D17/02C25D17/06C25D21/10
Inventor 杜秀清
Owner 成都展讯通信技术有限公司
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