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Cooling device for LED array device

A technology for LED arrays and cooling devices, which is applied in cooling/heating devices of lighting devices, lighting devices, semiconductor devices of light-emitting elements, etc., can solve problems such as increased manufacturing costs, poor heat dissipation efficiency, and increased costs, and achieve phase conversion Heat promotion, improved heat transfer efficiency, and easy maintenance

Active Publication Date: 2018-05-15
盐城市新亚自控设备股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the heat generated on the front side can only be taken away from the back side, the heat dissipation efficiency is poor, which affects the service life of the LED array device to a certain extent
There are also multiple copper tubes that pass through the space between the LED arrays on the substrate to dissipate heat, but a forced-flow ventilation fan is required on the back of the substrate to meet the cooling and heat dissipation requirements.
This has led to a significant increase in the power consumption of the forced-flow ventilation fan, and has also increased the manufacturing cost.
[0004] At the same time, in order to cool the LEDs on the tightly packed substrate, the cost of manufacturing LEDs and using LEDs increases
For example, more than 70% of the electricity cost of LED array devices is consumed by forced air fans for cooling
The heat dissipation layer added during the manufacturing process also increases the cost of the LED array device

Method used

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  • Cooling device for LED array device
  • Cooling device for LED array device
  • Cooling device for LED array device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] As shown in the figure, the LED array device 100 includes a substrate 101, and a plurality of LED light-emitting elements 102 are mounted on the substrate 100; a lens 103 is installed on each LED light-emitting element 102 to direct the light from the LED light-emitting element.

[0043] A cooling device for LED array devices, comprising a plurality of tube-shaped evaporators 1, condensation chamber 2 and heat dissipation fins 3; condensation chamber 2 includes a cylindrical body 2.1 with an upper opening and a circular cover plate 2.2, the cover plate The 2.2 screw is fixed on the body 2.1. A plurality of installation holes 2.3 are provided on the bottom plate of the body; the tube-shaped evaporator 1 is made of fast heat-conducting materials, such as copper, aluminum alloy or graphene or other materials with high thermal conductivity. The tubular evaporator 1 is installed on the installation hole 2.3 of the bottom plate of the condensation chamber 2; the tubular evapo...

Embodiment 2

[0054] The tubular evaporator 1 includes a tube body 1.1, which is closed at both ends and contains a phase-change working medium; the condensation chamber 2 is filled with heat transfer oil, and the liquid surface of the heat transfer oil is at least in contact with the condensation of the cooling fins 3 Section 3.1;

[0055] Other features are the same as in Example 1. The phase change heat dissipation in embodiment 2 occurs at the upper end of the tubular evaporator 1, the heat is transferred from the upper tube wall of the tubular evaporator 1 to the heat transfer oil, and the heat transfer oil is transferred to the cooling fins, and the heat transfer medium of heat transfer oil is added in the middle , the phase change heat transfer increases the link, and reduces the efficiency of the phase change heat dissipation compared with Example 1.

[0056] The cooling device of the LED array device uses both conduction heat dissipation and phase change heat dissipation, has a si...

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Abstract

The invention discloses a cooling device of an LED array device. The cooling device comprises multiple pipe-shaped evaporators, a condensation chamber, heat dissipating manifolds and a center heat dissipating manifold; the condensation chamber includes a cylindrical main body opened in the top and a circular cover plate; the circular cover plate includes a conical condensation top inwards recessed; multiple heat dissipating manifolds are inserted in the conical condensation top; the pipe-shaped evaporators are spaced on a main body baseplate of the condensation chamber in an array form, and penetrate through substrates to extend among LED arrays; phase changeable working mediums are filled in the pipe-shaped evaporators; the top of a heat dissipating part is fixedly connected with the center heat dissipating manifold; the center heat dissipating manifold includes a center heat conducting part, a bridge part and a heat transfer flange connected integrally; the heat transfer flange is fixed on a mounting plate of an illuminating device; and the center heat conducting part is fixedly connected with the heat dissipating part. The cooling device of the LED array device solves the technical difficulties of quick heat dissipation and uniform heat dissipation with low cost and simple structure.

Description

technical field [0001] The invention relates to the technical field of LED array devices, in particular to a cooling device for LED array devices. Background technique [0002] As an active self-luminous device, LED is a solid-state lighting that does not burn filaments or gases. It has low power consumption, low operating voltage, high luminous brightness, long working life, and stable performance. It can work in extreme environments with little performance attenuation. Due to its characteristics, it has been widely used. Since multiple shadows are reduced when multiple LEDs are gathered, the tight gathering of LEDs, that is, LED array devices, came into being. The LED array device is a two-dimensional array of micro-sized highly light-emitting diode cores arranged in high-density integration on the same epitaxial substrate material, and each LED is a high-power LED with a power greater than 0.5W. And when the LEDs are extremely close to each other, overheating will occur....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V29/51F21Y115/10
CPCF21V29/51
Inventor 王剑章王洪君王洪伟
Owner 盐城市新亚自控设备股份有限公司