Heat dissipation structure of handheld device

Abstract

The invention relates to a heat dissipation structure of a handheld device. The heat dissipation structure comprises a display module, a uniform temperature plate, a first electronic part group, a frame body and a cover plate, wherein the first electronic part group is arranged between the uniform temperature plate and the display module, the frame body is provided with a first accommodation space and a second accommodation space, the first accommodation space is used for sequentially accommodating the display module, the first electronic part group and the uniform temperature plate, the second accommodation space is used for accommodating the cover plate, heat of the first electronic part group, which is received, is rapidly and uniformly diffused and dissipated by the uniform temperature plate, so that the heat is effectively prevented from being accumulated at a heat generation source of the handheld device.

Description

[0001] 【Technical field】 [0002] The present invention relates to a hand-held device, in particular to a heat-dissipating structure of the hand-held device that quickly and evenly diffuses and dissipates the heat of the hand-held device to effectively prevent the heat from gathering at the heat source of the hand-held device. [0003] 【Background technique】 [0004] Known handheld devices (such as mobile phones, tablet computers, personal digital assistants (PDAs), and digital cameras) are mostly low-power and do not require the use of heat sinks, but looking to the future, when the temperature generated by the electronic heating elements inside the handheld device When it is higher, it may be necessary to use heat sinks and other heat dissipation devices to assist in heat dissipation. [0005] However, installing a cooling device inside the handheld device will inevitably occupy the internal space of the handheld device, resulting in an increase in the volume of the handheld ...

AI Technical Summary

Problems solved by technology

[0005] However, installing a cooling device inside the handheld device will inevitably occupy the internal space of the handheld device, resulting in an increase in the volume of the handheld device, which is difficult to meet the thinning requirements of modern electronic products

Secondly, the heat dissipation device installed inside the handheld device is difficult to quickly dissipate the heat, and the heat accumulates inside the handheld device, which easily affects the normal operation of the electronic components inside the handheld device

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