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Method for splitting brittle substrate

A brittle substrate, directly under the technology, applied in the direction of fine working equipment, glass manufacturing equipment, glass cutting equipment, etc., can solve the problem of unstable scribing, and achieve the effect of stable breaking

Inactive Publication Date: 2017-02-22
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, when the film is provided on the substrate, the scribing line tends to become unstable.

Method used

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  • Method for splitting brittle substrate
  • Method for splitting brittle substrate
  • Method for splitting brittle substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0049] The method of breaking the brittle substrate of the present embodiment will be described below.

[0050] Refer to figure 1 (A) and (B), first prepare the glass substrate 4 (brittle substrate) ( Figure 4 : Step S10). The glass substrate 4 has an upper surface SF1 (surface) and a lower surface SF2 opposite to it. The glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1. In addition, a cutting tool 50 having a knife tip 51 and a knife handle 52 is prepared. The cutting edge 51 is held by being fixed to the knife handle 52 as its holder.

[0051] Next, the knife tip 51 is pressed against the upper surface SF1 of the glass substrate 4 ( Picture 8 : Step S20). Next, the pressed blade tip 51 is slid on the upper surface SF1 of the glass substrate 4 (refer to figure 1 The arrow in (A)).

[0052] Refer to figure 2 In (A) and (B), the upper surface SF1 of the glass substrate 4 is plastically deformed by the sliding of the blade 51. Thereby, on th...

Embodiment approach 2

[0068] In the method of breaking a brittle substrate of this embodiment, first, the same steps as in Embodiment 1 are carried out to figure 2 (A) and (B) process.

[0069] Refer to Picture 11 (A) and (B), then, maintaining the crack-free state, and forming a film 22 on the surface SF1 of the glass substrate 4 ( Picture 8 : Step S40). The formation of the film 22 is performed in a manner to cover the trench line TL at least partially. The film 22 may be made of synthetic resin.

[0070] Refer to Picture 12 (A) and (B), and then prepare a cutting tool 50p having a tip 51p and a handle 52p. The blade edge 51p is held by being fixed to a shank 52p as its holder. The cutting tool 50p is more suitable for processing the film 22 than the cutting tool 50.

[0071] Then refer to Figure 13 (A) and (B), using the tip 51p, along the groove line TL (refer to Picture 12 (A) Arrow) The incision HL is made in the membrane 22. The notch HL is formed by completely cutting the film 22 in the ...

Embodiment approach 3

[0088] First, the cutting edge used in the breaking method of the brittle substrate of this embodiment will be described below.

[0089] Refer to Figure 20 In (A) and (B), a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1 are provided on the cutting edge 51. The plurality of surfaces include side surface SD2 (second surface) and side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and SD3 (the first to third surfaces) face different directions and are adjacent to each other. The blade edge 51 has an apex where the top surface SD1, the side surfaces SD2, and SD3 meet, and the protrusion part PP of the blade edge 51 is formed by the apex. In addition, the side surfaces SD2 and SD3 form the ridge line of the side PS of the blade edge 51. The side portion PS extends linearly from the protrusion PP. In addition, since the side portion PS is a ridgeline as described above, it has a convex shape extending linearly....

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PUM

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Abstract

A cutting edge (51) is slid across the surface (SF1) of a brittle substrate (4) so as to cause plastic deformation and form a trench line (TL). The step in which said trench line (TL) is formed is performed in such a manner so as to produce a crack-free state in which, directly underneath the trench line (TL), the brittle substrate (4) is connected in a continuous fashion in a direction that intersects the trench line (TL). Next, a film (21) that at least partially covers the trench line (TL) is formed on the surface (SF1) of the brittle substrate (4), and a crack is then made to extend along the trench line (TL), forming a crack line (CL).

Description

Technical field [0001] The invention relates to a method for breaking a brittle substrate, in particular to a method for breaking a brittle substrate provided with a film. Background technique [0002] In the manufacture of power equipment such as flat display panels or solar cell panels, it is often necessary to break brittle substrates such as glass substrates. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. The scribe line can be formed by machining the substrate using a cutting machine. The cutting machine slides or rolls on the substrate to form a groove on the substrate by plastic deformation, and at the same time, a vertical crack is formed directly under the groove. Subsequently, the stress application of the so-called breaking process is performed. Through the breaking process, the crack is completely advanced in the thickness direction, thereby breaking the substrate. [0003] A film may be provided on the brok...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/037B28D5/00
CPCB28D5/00C03B33/037B28D5/0011B28D5/0017C03B33/033
Inventor 曾山浩
Owner MITSUBOSHI DIAMOND IND CO LTD