Breaking method of brittle substrate
A brittle substrate, directly under the technology, applied to fine working devices, manufacturing tools, glass cutting devices, etc., can solve problems such as unstable scribing and achieve stable breaking effects
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Embodiment approach 1
[0050] The breaking method of the brittle substrate of this embodiment will be described below.
[0051] refer to figure 1 (A) and (B), at first prepare glass substrate 4 (brittle substrate) ( Figure 4 : step S10). Glass substrate 4 has upper surface SF1 (surface), and lower surface SF2 opposite to it. The glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1. In addition, a cutting tool 50 having a tip 51 and a handle 52 is prepared. The blade tip 51 is held by being fixed to a blade handle 52 serving as a holder.
[0052] Next, the blade tip 51 is pressed against the upper surface SF1 of the glass substrate 4 ( Figure 8 : step S20). Then, the pressed blade tip 51 is slid on the upper surface SF1 of the glass substrate 4 (refer to figure 1 Arrow in (A)).
[0053] refer to figure 2 (A) and (B), plastic deformation occurs on the upper surface SF1 of the glass substrate 4 by the sliding of the blade edge 51 . Thereby, on the upper sur...
Embodiment approach 2
[0069] In the breaking method of the brittle substrate of the present embodiment, first, the same steps as those of the first embodiment are performed up to figure 2 (A) and (B) steps.
[0070] refer to Figure 11 (A) and (B), then, maintaining the crack-free state, a film 22 is formed on the surface SF1 of the glass substrate 4 ( Figure 8 : step S40). The film 22 is formed so as to at least partially cover the trench line TL. The film 22 may be made of synthetic resin.
[0071] refer to Figure 12 (A) and (B), Next, a cutting tool 50p having a blade tip 51p and a blade handle 52p is prepared. The blade tip 51p is held by being fixed to a blade handle 52p serving as a holder. The cutting implement 50 p is more suitable for processing the film 22 than the cutting implement 50 .
[0072] And then refer to Figure 13 (A) and (B), using the tool nose 51p, along the groove line TL (refer to Figure 12 An arrow in (A) cuts a notch HL in the membrane 22 . The slit HL is f...
Embodiment approach 3
[0089] First, the cutting edge used in the breaking method of the brittle substrate of this embodiment will be described below.
[0090] refer to Figure 20 In (A) and (B), a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1 are provided on the blade edge 51 . The plurality of surfaces include side SD2 (second surface) and side SD3 (third surface). The top surface SD1, the side surfaces SD2, and SD3 (first to third surfaces) face directions different from each other, and are adjacent to each other. The blade edge 51 has a vertex where the top surface SD1 and the side surfaces SD2 and SD3 meet, and the vertex forms the protrusion PP of the blade edge 51 . In addition, the side surfaces SD2 and SD3 form a ridge line constituting the side PS of the blade edge 51 . The side portion PS linearly extends from the protrusion portion PP. Moreover, since the side part PS is a ridge line as mentioned above, it has the convex shape extended li...
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