An anti-crack printed circuit board
A printed circuit board, anti-fracture technology, applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve the problems of self-weight fracture, insulation substrate unfavorable multi-layer circuit insulation, etc.
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Embodiment 1
[0030] This embodiment provides an anti-break printed wiring board, such as figure 1 , including the first base layer 1 and the second base layer 2 stacked in sequence; the joint surfaces of the first base layer 1 and the second base layer 2 are provided with a plurality of buffer cavities; the buffer cavities are filled with buffer blocks 3; the buffer Arrayed buffer holes 31 are provided inside the block. In this embodiment, the first base layer and the second base layer are implemented with epoxy resin.
[0031] Further, the raw materials of the buffer block include by weight
[0032] Nylon 66 70 parts;
[0033] 20 parts of glass fiber;
[0034] 0.007 parts of cobalt nitrate;
[0035] 1.6 parts of dimethylformamide;
[0036] Polyetheretherketone 0.001 parts.
[0037] Preferably, the buffer block is prepared by adding nylon 66, glass fiber, cobalt nitrate, dimethylformamide, and polyether ether ketone into a high-speed mixer according to the set weight parts, and then ...
Embodiment 2
[0039] This embodiment provides an anti-fracture printed circuit board, which includes a first base layer and a second base layer stacked in sequence; a plurality of buffer cavities are provided on the joint surfaces of the first base layer and the second base layer; It is filled with a buffer block; arrayed buffer holes are arranged in the buffer block. In this embodiment, the first base layer and the second base layer are prepregs.
[0040] Further, the raw materials of the buffer block include by weight
[0041] Nylon 66 85 parts;
[0042] 8 parts glass fiber;
[0043] 0.012 parts of cobalt nitrate;
[0044] 0.8 part of dimethylformamide;
[0045] Polyetheretherketone 0.006 parts.
[0046] Preferably, the buffer block is prepared by adding nylon 66, glass fiber, cobalt nitrate, dimethylformamide, and polyether ether ketone into a high-speed mixer according to the set weight parts, and then heating it through a twin-screw extruder. The plasticized nylon 66 mixture is o...
Embodiment 3
[0048] This embodiment provides an anti-fracture printed circuit board, which includes a first base layer and a second base layer stacked in sequence; a plurality of buffer cavities are provided on the joint surfaces of the first base layer and the second base layer; It is filled with a buffer block; arrayed buffer holes are arranged in the buffer block.
[0049] Further, the raw materials of the buffer block include by weight
[0050] Nylon 66 83 parts;
[0051] 11 parts of glass fiber;
[0052] 0.008 parts of cobalt nitrate;
[0053] 1.1 parts of dimethylformamide;
[0054] Polyetheretherketone 0.005 parts.
[0055] Preferably, the buffer block is prepared by adding nylon 66, glass fiber, cobalt nitrate, dimethylformamide, and polyether ether ketone into a high-speed mixer according to the set weight parts, and then heating it through a twin-screw extruder. The plasticized nylon 66 mixture is obtained at 190-200°C, and then the plasticized nylon 66 mixture is extruded b...
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