An integrated installation method of a separation device and a printed circuit board

Abstract

The invention discloses a separating device and printed circuit board integrated installation method, and the method comprises the steps: respectively installing a TO packaging device integrated installation assembly (1), an EL-type relay integrated installation assembly (2), and an E-type plane transformer integrated installation assembly (3); controlling the distance from the bottom surface of each assembly to a printed circuit board (4), and achieving the integrated installation. The method optimizes the conventional assembly flow of a separating device, improves the assembly precision, improves the welding point reliability of a wire, improves the overall heat-dissipation efficiency of the printed circuit board and the separating device, improves the overall anti-mechanical performance of the separating device and the printed circuit board, and achieves the overall disassembly and assembly of the separating device and the printed circuit board.

Description

technical field [0001] The invention relates to a separation device and a method for installing a printed circuit board. Background technique [0002] With the rapid development of aerospace electronic products, miniaturization of products, high density of internal devices, and high efficiency of product function output are the current development trends of aerospace electronic products, but it is accompanied by difficulties in device installation, product debugging and disassembly. Difficulty in operation and many other problems; many electronic products become one-way operation after assembly. Once a problem occurs, it becomes extremely difficult to disassemble the product again, especially with some discrete devices such as TO packaged devices, E-type planar transformers, and EL-type relays. installation is particularly prominent. [0003] The assembly process of traditional separation devices is complicated and cumbersome. The operation process is generally: separation ...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of aerospace electronic products, miniaturization of products, high density of internal devices, and high efficiency of product function output are the current development trends of aerospace electronic products, but it is accompanied by difficulties in device installation, product debugging and disassembly. Difficulty in operation and many other problems; many electronic products become one-way operation after assembly. Once a problem occurs, it becomes extremely difficult to disassemble the product again, especially with some discrete devices such as TO packaged devices, E-type planar transformers, and EL-type relays. The installation is particularly prominent

[0003] The assembly process of traditional separation devices is complicated and cumbersome. The operation process is generally: separation device and auxiliary assembly tooling trial installation → auxiliary assembly tooling and product structure clamping → separation device and printed circuit board wire welding → removal of auxiliary assembly tooling → Fixing of separation device and product structural parts → separation device solid sealing

If the relevant design needs to be adjusted after the product is assembled, the repeated disassembly and assembly of the product will reduce the assembly accuracy of the product, the repeated desoldering and re-soldering of the solder joints will reduce the reliability of the solder joints, and the repeated application of thermal conductive fillers will increase the contact thermal resistance. The heat dissipation performance of the product is reduced, and the repeated disassembly of the fastener reduces the thread strength, thereby reducing the mechanical resistance of the separation device and the printed circuit board

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