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Systems and methods for simultaneous darkfield and phase contrast inspection

A dark field, optical subsystem technology, used in instrumentation, semiconductor/solid-state device testing/measurement, measurement devices, etc., to solve problems such as reducing the value of the wafer inspection process

Active Publication Date: 2019-02-01
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, performing DF and DIC inspection in separate operations reduces the value of the wafer inspection process

Method used

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  • Systems and methods for simultaneous darkfield and phase contrast inspection
  • Systems and methods for simultaneous darkfield and phase contrast inspection
  • Systems and methods for simultaneous darkfield and phase contrast inspection

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Embodiment Construction

[0014] Reference will now be made in detail to the disclosed subject matter, which is illustrated in the accompanying drawings.

[0015] generally refer to Figures 1A to 1D , describing systems and methods for simultaneous dark field (DF) and differential interference contrast (DIC) inspection according to the present invention. U.S. Patent No. 5,798,829 to Vaez-Iravani, issued Aug. 25, 1998, discloses the use of a single laser to make separate measurements of DF and DIC signals from a sample, described in its entirety Incorporated herein by reference. US Patent No. 7,345,754 issued March 18, 2008 to Zhao, which is incorporated herein by reference in its entirety, discloses the use of a bright field (BF) inspection system for performing DF inspection.

[0016] Simultaneous analysis of scatter-based DF signals and phase-based DIC signals can significantly enhance the detection and classification of defects (or other features) for a given sample. The DF and DIC signals are g...

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PUM

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Abstract

The invention relates to an inspection device for simultaneous dark field DF and differential interference contrast DIC inspection, which includes an illumination source and a sample stage configured to fix a sample. The inspection apparatus includes a first sensor, a second sensor, and an optical subsystem. The optical subsystem includes an objective lens, one or more optical elements arranged to direct illumination from the one or more illumination sources to the surface of the sample through the objective lens. The objective lens is configured to collect a signal from the surface of the sample, wherein the collected signal includes a scatter-based signal and / or a phase-based signal from the sample. The inspection apparatus comprises one or more separating optical elements arranged to spatially separate the collected signal into the DF signal and the DIC signal by directing the DF signal and the DIC signal along the DF path and the DIC path, respectively. the DIC signal.

Description

[0001] Cross References to Related Applications [0002] This application is claimed under 35 U.S.C. §119(e) and the title of the application filed on July 22, 2014 is "APPARATUS AND METHODOLOGY FOR SIMULTANEOUS DARKFIELD AND PHASE CONTRAST INSPECTION" , U.S. Provisional Application Serial No. 62 / 027,393, inventors named Chuanyong Huang, Qing Li, D. Pettibone, and B. Graves , which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates generally to defect detection and classification, and more particularly, the present invention relates to simultaneous dark field inspection and differential interference contrast inspection. Background technique [0004] As the tolerances on semiconductor device manufacturing processes continue to narrow, the demand for improved semiconductor wafer inspection tools continues to increase. Types of inspection tools suitable for wafer inspection include dark field (DF) inspection tools that...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCG01N21/8806G01N21/9501G01N2021/8825
Inventor 黄传勇李晴D·佩蒂伯恩B·格拉韦斯
Owner KLA CORP