Wafer marking mechanism
A technology of wafer and grasping mechanism, applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of low efficiency, long waiting time, increased production cost, etc., achieve good continuity and improve work efficiency , the effect of reducing production costs
Active Publication Date: 2017-04-26
SHENZHEN INTE LASER TECH
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Problems solved by technology
[0002] Existing wafer marking uses dual lasers to mark a product at the same time, and uses a robot to pick and place the product seat. This method has long waiting time, low efficiency, and increases production costs.
Method used
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Embodiment Construction
[0023] Such as Figure 1 to Figure 8 As shown, the present invention discloses a wafer marking mechanism, including a base 1, a bracket 2, a feeding box 3 and a grabbing mechanism 4, the bracket 2 is installed on the upper end of the base 1, and the upper end of the bracket 2 is provided with A plurality of marking platforms 21 arranged in a line, four marking platforms 21 in this embodiment, the feeding box 3 is arranged at one end of the support 2 and installed on the base 1 for feeding, A correction platform 5 is also provided between the support 2 and the feeding box 3. The correction platform 5 is provided with a positioning CCD for rough positioning. The first slide rail 7, the grabbing mechanism 4 is set on the first slide rail 7, the products in the feeding box 3 can be placed on the marking product table in sequence, the continuity is better, and the production is greatly improved. efficiency.
[0024] The other side of the upper end of the base 1 is also provided w...
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The invention provides a wafer marking mechanism. The wafer marking mechanism comprises a base, a support, a feeding box and a grabbing mechanism. The support is installed at the upper end of the base. A plurality of marking platforms which are linearly arrayed are arranged at the upper end of the support. The feeding box is arranged at one end of the support and installed on the base, and a correcting platform is further arranged between the support and the feeding box. A first sliding rail parallel to the support is further arranged at one side of the upper end of the base. The grabbing mechanism is arranged on the first sliding rail. By means of the wafer marking mechanism, wafers of different dimensions can be marked by replacing a supporting plate, the large-sized wafers can be sequentially placed on the different marking platforms, and thus different positions of the wafers can be marked; and in this way, marking continuity is made better, working efficiency is improved, and production cost is reduced.
Description
technical field [0001] The invention relates to the field of wafer marking, in particular to a wafer marking mechanism. Background technique [0002] Existing wafer marking uses dual lasers to mark a product at the same time, and uses a robot to pick and place the product seat. This method has long waiting time, low efficiency, and increases production costs. Contents of the invention [0003] In order to solve the problems in the prior art, the present invention provides a wafer marking mechanism. [0004] The present invention provides a wafer marking mechanism, which includes a base, a bracket, a feeding box and a grabbing mechanism. The bracket is installed on the upper end of the base, and the upper end of the bracket is provided with a plurality of marking platforms arranged in a line. The feeding box is arranged at one end of the bracket and installed on the base, a correction platform is also provided between the bracket and the feeding box, and an upper side of t...
Claims
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IPC IPC(8): B23K26/362B23K26/70
CPCB23K26/361B23K26/702
Inventor 邹武兵张德安禹刚
Owner SHENZHEN INTE LASER TECH