A kind of fixing method of double-sided scraping solder paste

Abstract

The invention discloses a fixing method for soldering paste scraping. A die matched with a printed circuit board in size is manufactured according to the printed circuit board; via holes in the printed circuit board are used as positioning holes, and positioning pins of the die are manufactured according to the size of the positioning holes; and the printed circuit board is fixed to the die, the positioning holes are matched with the positioning pins, then the die to which the printed circuit board is fixed is pushed into a clamping groove of a screen mesh steel plate, three positions of the screen mesh steel plate are provided with fixing plates used for fixing the position of the printed circuit board, and the clamping groove is formed among the fixing plates at the three positions. According to the fixing method, the screen mesh steel plate has a function of fixing the printed circuit board, in the back face soldering paste scraping process, an element welded to the front face of the printed circuit board is not allowed to make contact with a silk screen table face, the printed circuit board keeps in a balanced state during soldering paste scraping, through holes in the screen mesh steel plate can well correspond to soldering pads on the printed circuit board, and soldering paste can be accurately scraped and printed to the soldering pads on the back face of the printed circuit board.

Description

technical field [0001] The invention relates to a fixing method for scraping solder paste on both sides. Background technique [0002] In the previous process of scraping solder paste on both sides of the fixing frame, the printed circuit board and the mold were not effectively fixed. When scraping the solder paste, the printed circuit board will be displaced, so that the solder paste cannot be accurately scraped onto the solder pad of the printed circuit board. And because the thickness of the mold material is relatively thin, when scraping the solder paste on the second side, the components soldered on the front side of the printed circuit board on the first side are in contact with the screen printing table, which may easily cause the components to be squeezed and damaged. [0003] Therefore, it is necessary to provide a new technical solution to solve the above problems. Contents of the invention [0004] The technical problem to be solved by the present invention is...

AI Technical Summary

Problems solved by technology

When scraping the solder paste, the printed circuit board will be displaced, so that the solder paste cannot be accurately scraped onto the solder pad of the printed circuit board

And because the thickness of the mold material is relatively thin, when scraping the solder paste on the second side, the components soldered on the front side of the printed circuit board on the first side are in contact with the screen printing table, which may easily cause the components to be squeezed and damaged

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