Assembly method of an embedded part, electronic equipment shell and electronic equipment

A technology of electronic equipment and assembly method, which is applied in the direction of cabinet/cabinet/drawer parts, etc., can solve the problem of mismatch between product shell and external product shell, etc.

Active Publication Date: 2017-05-10
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an assembling method for an embedded sign, an electronic device casing and an electronic device, which solves the problem that the embedded product casing is easily separated from the external product casing when the product casing filling the embedded part is separated during the assembly process in the prior art. Issues where the product case inside the part does not match the product case outside

Method used

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  • Assembly method of an embedded part, electronic equipment shell and electronic equipment
  • Assembly method of an embedded part, electronic equipment shell and electronic equipment
  • Assembly method of an embedded part, electronic equipment shell and electronic equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0022] This embodiment provides a method for assembling embedded components, such as figure 1 As shown, the method includes steps 100 to 130 .

[0023] Step 100: Process the outer surface of the electronic device housing to obtain a first groove that matches the shape of the outer surface of the embedded component.

[0024] A groove matching the shape of the embedded part is milled out on the outer surface of the electronic device casing at a preset position for assembling the embedded part, which is used as a first groove for accommodating the part. the embedded components. The electronic device housing inside the first groove is the electronic device housing inside the embedded component after the assembly is completed; the electronic device housing outside the first groove is the electronic device housing surrounding the embedded component after the assembly is completed body. Taking the embedded component as an O-shape as an example, the shape of the first groove obtain...

Embodiment 2

[0037] see image 3 , this embodiment provides a method for assembling an embedded component, the method includes steps 300 to 340 .

[0038] Step 300: Process the outer surface of the electronic device housing to obtain a first groove that matches the shape of the outer surface of the embedded component.

[0039] The specific implementation of processing the first groove matching the shape of the outer surface of the embedded component on the outer surface of the electronic device housing can refer to Embodiment 1, and details are not repeated here.

[0040] Step 310 , by injecting an adhesive substance into the first groove, the electronic device casing inside the first groove is fixed to the electronic device casing outside the first groove.

[0041] In this embodiment, the electronic device casing inside the first groove and the electronic device casing outside the first groove are fixed by injecting an adhesive substance into the first groove as an example, A specific s...

Embodiment 3

[0055] refer to Figure 5 , correspondingly, the embodiment of the present invention also discloses an electronic device casing 50 . The electronic device housing 50 includes: an embedded component 501 , and the embedded component 501 is assembled on the electronic device housing 50 according to the embedded component assembling methods disclosed in the first and second embodiments.

[0056] During specific implementation, firstly, a first groove matching the shape of the outer surface of the embedded component is processed on the outer surface of the electronic device casing; The outer surface covering sticker of the equipment casing fixes the electronic equipment casing inside the first groove to the electronic equipment casing outside the first groove; then, the inner surface of the electronic equipment casing is processed a second groove that communicates with the first groove; finally, the embedded component is assembled in the slot space formed by the first groove and t...

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PUM

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Abstract

The invention provides an assembly method of an embedded part. The assembly method is applied to electronic equipment and belongs to the technical field of mobile communication. The method comprises the steps of processing an outer surface of an electronic equipment shell to obtain a first groove matched with the shape of the outer surface of the embedded part; fixing the electronic equipment shell in the first groove in the electronic equipment shell outside the first groove; processing an inner surface of the electronic equipment shell to obtain a second groove communicating with the first groove; and assembling the embedded part in a groove space formed by the first groove and the second groove. With the method disclosed by the embodiment of the invention, the problem that a product shell in the embedded part is not matched with an external product shell caused by after the product shell filled in the embedded part is easy to separate from the external product shell during the assembly process in the prior art is solved.

Description

technical field [0001] The present invention relates to the technical field of mobile communication, in particular to an assembling method of an embedded component, an electronic device casing and an electronic device. Background technique [0002] In the process of assembling a product, it is often necessary to assemble embedded components on the surface of the product, for example, setting a brand logo on the surface of the product to enhance the branding power of the product. Among the assembled embedded components, the assembly method of the embedded components with closed graphics is the most complicated. In the prior art, when assembling embedded components with closed graphics, in order to prevent the embedded components from falling, usually when the embedded component mounting holes are machined on the outer product shell of the product, for the product shell filling the interior of the embedded component, The hanging table structure is processed to prevent the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02
Inventor 胡柳见曾佑华朱家智
Owner VIVO MOBILE COMM CO LTD
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