Abrasive tool with multi-layer heat dissipation structure

Abstract

The invention relates to a grinding tool with a multilayer heat dissipation structure. The grinding tool consists of a grinding part and a heat dissipation part integrally molded and with overlapped circle centers; multiple heat dissipation blocks are arranged in the grinding part; and the heat dissipation part is divided into multiple heat dissipation layers integrally molded in sequence by one end combined with the grinding part in the circle center direction. When the cutting hardness of the grinding tool with the multilayer heat dissipation structure is guaranteed, the heat dissipation structure-multiple heat dissipation layers and heat dissipation blocks capable of taking out heat of the grinding tool with the multilayer heat dissipation structure in the working process is added, so that the heat dissipation performance of the grinding tool with the multilayer heat dissipation structure is guaranteed, the heat dissipation is fast in the grinding process, the cooling effect is guaranteed, the cooling efficiency is improved, the excellent performance is guaranteed, and the service life is prolonged.

Description

technical field [0001] The invention relates to a grinding work, in particular to a grinding tool with a multi-layer heat dissipation structure for grinding, polishing and grinding workpieces. Background technique [0002] The organic abrasive tool with multi-layer heat dissipation structure refers to the use of organic molecular compounds as binders to consolidate the abrasive grains together to form a grinding tool with a certain rigidity. Organic abrasive tools with multilayer heat dissipation structure include abrasive tools with multilayer heat dissipation structure made of natural and synthetic resins, and rubber with multilayer heat dissipation structure made of natural or synthetic rubber binders. Abrasives. [0003] Organic abrasive tools with a multi-layer heat dissipation structure are generally composed of abrasives, organic binders and pores. Wherein, the organic binder includes resin binder and rubber binder. Polyurethane is a common rubber bond and a common...

AI Technical Summary

Problems solved by technology

[0006] 1) When the coolant is cooled, the cooling effect of the abrasive tool with a multi-layer heat dissipation structure for the binder with a temperature resistance lower than 200°C is not ideal;

[0007] 2) For an environment with a relatively large grinding contact area (such as a large contact surface when grinding a cup-shaped grinding wheel), the coolant cannot enter the working surface well, resulting in cooling failure;

[0008] 3) The binder material itself is a poor conductor of heat, so the high temperature generated locally by the abrasive during the grinding process cannot be quickly transmitted to form a heat dissipation effect, so the local high temperature of up to 800 ° C will also greatly affect the The transition zone properties of the abrasive and the bonding agent make the abrasive and the bonding agent not well bonded, which directly leads to a sharp decline in the performance of the abrasive tool with a multi-layer heat dissipation structure

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