Manufacturing method of abrasive tool with multi-layer heat dissipation layer and heat dissipation structure
A manufacturing method and heat dissipation structure technology, applied in the direction of manufacturing tools, abrasives, grinding devices, etc., can solve the performance degradation of abrasives and bonded abrasives, affect the properties of abrasives and bonded transition zones, and the cooling effect of bonded abrasives Unsatisfactory problems, to achieve the effect of guaranteed performance, guaranteed grinding hardness, and optimized cooling effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0054] The manufacturing method of the grinding tool provided by the invention with multi-layer heat dissipation layer and heat dissipation structure comprises the following steps:
[0055] Step 1: Weighing:
[0056]Weigh the filler in proportion, mix the filler with the abrasive at least twice to form a dry material mixture, and mix the binder with the defoamer, curing agent, and stabilizer to prepare the binder mixture;
[0057] Step 2: Manufacture a variety of dry material mixtures with different specific gravity of heat dissipation materials:
[0058] Adding heat-dissipating materials that account for the first percentage weight into part of the dry material mixture, and stirring to form a grinding layer dry material;
[0059] Add heat dissipation material with a percentage of the second percentage weight to part of the dry material of the grinding layer, and stir to form a heat dissipation block dry material;
[0060] Adding heat dissipation material which accounts for ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



