Improved substrate-free tape

A technology without substrate and tape, applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problems of poor heat insulation, poor heat dissipation, failure of electronic components, etc., to reduce poor adhesion , fast paste, paste firmly effect

Inactive Publication Date: 2017-06-13
WUHU HONGSHENG TECH
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At the same time, the existing adhesive tapes are mainly used in electronic components. Electronic components are often in high-temperature working conditions. The tapes in the prior art often only play the role of sealing and fixing, which not only cannot conduct heat well, but also is not conducive to heat dissipation because of its heat insulation; therefore, how to improve the existing tapes to achieve ideal heat dissipation performance is a Technical problems urgently needed to be solved in this field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Improved substrate-free tape
  • Improved substrate-free tape
  • Improved substrate-free tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 and figure 2 Shown, a kind of improved non-substrate adhesive tape, comprise first release layer 1, pressure-sensitive adhesive layer 2 and second release layer 3 successively, wherein the peeling force of first release layer 1 is less than the second release layer The peel force of 3, the first release layer 1 and the second release layer 3 are both strip-shaped structures, and the pressure-sensitive adhesive layer 2 is a plurality of rectangular blocks evenly distributed along the first release layer of the strip structure. The distance between adjacent rectangular blocks is 3mm (the value can also be other values ​​between 0.5mm-10mm, no need to tear off and remove the adhesive layer a little bit, easy to use); the edge distance of the pressure-sensitive adhesive layer 2 is the first distance The edge of the type paper layer is 2mm (the value can also be other values ​​between 0.5-3mm, which can ensure that there will be no glue overflow during p...

Embodiment 2

[0033] Such as figure 1 and image 3 Shown, a kind of improved non-substrate adhesive tape, comprise first release layer 1, pressure-sensitive adhesive layer 2 and second release layer 3 successively, wherein the peeling force of first release layer 1 is less than the second release layer The peel force of 3, the first release layer 1 and the second release layer 3 are both strip-shaped structures, and the pressure-sensitive adhesive layer 2 is a plurality of rectangular blocks evenly distributed along the first release layer of the strip structure. The distance between adjacent rectangular blocks is 5mm (the value can also be other values ​​between 0.5mm-10mm, no need to tear off and remove the adhesive layer a little bit, easy to use); the edge distance of the pressure-sensitive adhesive layer 2 is the first distance The edge of the type paper layer is 1mm (the value can also be other values ​​between 0.5-3mm, which can ensure that there will be no glue overflow during pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses an improved substrate-free tape. The improved substrate-free tape sequentially comprises a first release layer, a pressure-sensitive adhesive layer and a second release layer, wherein the release force of the first release layer is less than that of the second release layer; both the first release layer and the second release layer are of a ribbon structure; the pressure-sensitive adhesive layer is a plurality of rectangular blocks uniformly distributed along the first release paper layer of the ribbon structure; the distance between every two adjacent rectangular blocks is 0.5-10mm; and the distance from the edge of the pressure-sensitive adhesive layer to the edge of the first release paper layer is 0.5-3mm.The improved substrate-free tape has the advantages of high viscosity, convenient use, no sticking after component bonding, easy tear-off and the like. According to the invention, a mixture of sodium hydrogen carbonate particles and carbon powder is added, so that the heat dissipation manner inside the pressure-sensitive adhesive layer can be effectively improved, the heat dissipation effect can obviously enhanced, thereby providing a novel improved substrate-free tape with a favorable heat dissipation function.

Description

technical field [0001] The invention relates to the field of adhesive tapes, in particular to an improved non-substrate adhesive tape used for bonding between components of industrial electronic appliances (such as computers, mobile phones, digital cameras, LCDs, etc.) and for bonding automotive interior accessories. Background technique [0002] The non-substrate double-sided adhesive is directly coated and pressed by acrylic adhesive. The color of the tape is transparent. The common thickness specification is: 0.06-0.13mm. It has excellent bonding effect, can prevent falling off and has excellent waterproof performance and processability. Good temperature resistance, good dimensional stability, thermal stability, chemical stability, good initial tack and stickiness. [0003] At present, the traditional industrial substrate-free tape has been widely used as the paste between electronic and electrical components, and has brought a revolutionary leap to the electronic and ele...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00
CPCC08K3/04C08K3/26C09J7/00C09J2203/326C09J2301/302C09J2301/312C09J2301/408C09J2433/00C09J2467/005
Inventor 甘露轩慎亚王俊飞
Owner WUHU HONGSHENG TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap