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Acoustic wave device and wafer level packaging method thereof

A kind of equipment and acoustic wave technology, applied in the field of acoustic wave equipment and its wafer-level packaging, can solve the problems of long pins, complicated manufacturing process, and large device volume

Active Publication Date: 2020-07-17
晨宸辰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] Metal packaging and plastic packaging have common disadvantages, such as relatively long pins, resulting in too large a volume of the device, and it is difficult to integrate with the RF front-end module
Ceramic-based surface-mount packaging is widely used, but the manufacturing process is complicated. Ceramic materials HTCC and LTCC are expensive, and it is difficult to integrate with other processes. At the same time, existing acoustic wave devices based on wafer-level packaging also exist. The process is difficult to realize and the defect of high cost

Method used

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  • Acoustic wave device and wafer level packaging method thereof
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  • Acoustic wave device and wafer level packaging method thereof

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0055] The relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0056] At the same time, it should be understood that, for the convenience of d...

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Abstract

The invention discloses acoustic equipment and a wafer-level packaging method thereof, which relate to the field of semiconductors. The acoustic equipment comprises a substrate and an acoustic device. The substrate is equipped with a cavity. The acoustic device and the substrate are integrated in such a way that the cavity is airtight. The acoustic device is equipped with pin pads for leading out the pins of the acoustic device, wherein the pin pads are not covered by the substrate. By packaging the acoustic device directly on the substrate, packaging equipment which is small, simple to make, low in cost and easy to integrate can be implemented.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an acoustic wave device and a wafer-level packaging method thereof. Background technique [0002] As the modes and frequency bands supported by the wireless mobile communication system continue to increase, the RF front-end architecture of the current wireless communication mobile terminal also becomes more and more complex. [0003] figure 1 It is a radio frequency front-end architecture for wireless communication mobile terminals that supports 2G, 3G, 4G multi-modes and multiple frequency bands in each mode. 108 is a radio frequency transceiver chip of the mobile terminal, responsible for sending the radio frequency signal generated by the baseband chip to the corresponding power amplifier chip and processing the received radio frequency signal. 107, 105, and 106 are respectively 2G power amplifier chips, 3G / 4G single-frequency power amplifier chips, and 3G / 4G multi-mode multi-f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H3/02H03H9/10H03H9/54H03H9/70H03H9/72H01L23/055H01L25/16
CPCH01L23/055H01L25/16H03H3/02H03H9/1007H03H9/1064H03H9/54H03H9/706H03H9/725H01L2224/16225H01L2224/48091H01L2924/16235H01L2924/00014
Inventor 陈高鹏刘海玲
Owner 晨宸辰科技有限公司