Uniform temperature plate structure and manufacture method thereof

Abstract

The invention relates to a uniform temperature plate structure which comprises a first plate body, a second plate body and working fluid, wherein the first plate body is provided with a hooked part; the second plate body is provided with a hook part; and the hook part and the hooked part are in contact with each other to be hooked. Through the design, the uniform temperature plate structure can prevent thermal expansion without an additional support structure and also has the characteristics of thinness and light weight.

Description

[0001] 【Technical field】 [0002] The present invention relates to a vapor chamber structure and its manufacturing method, especially to a vapor chamber structure and its manufacturing method that do not require additional support structures to greatly reduce production costs and prevent thermal expansion. [0003] 【Background technique】 [0004] The current mobile devices, personal computers, servers, communication chassis or other systems or devices are all due to the improvement of computing performance, and the heat generated by their internal computing units is also increasing. Therefore, a cooling unit is relatively needed to assist in cooling. The vast majority of manufacturers use radiators, heat pipes, vapor chambers and other heat dissipation elements with fans for auxiliary heat dissipation, and when large-area heat dissipation is required, they use vapor chambers to absorb heat and cooperate with radiators and cooling fans for forced heat dissipation. Because the he...

AI Technical Summary

Problems solved by technology

[0007] 1. There must be a supporting structure;

[0008] 2. A substantial increase in production costs;

[0009] 3. Cannot be effectively thinned;

[0010] 4. There will be problems with thermal expansion

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