Cold plate module cooling system

Abstract

The invention discloses a cold plate module cooling system. The system comprises a liquid cooling case, a cold plate, a fluid connector, an adapter connector and an external connector. The liquid cooling case mainly consists of a cover plate, a left side plate, a front wall plate, a base bracket, a rear IO panel, a right side plate, a rear wall plate and a base bracket-runner cover plate. The front wall plate and the rear wall plate adopt a snake-shaped runner mode, so that a part of heat of a daughter board module is conducted to the front and rear wall plates of the case to carry out cooling, and meanwhile, the case and a runner of the cold plate can be effectively cut through so as to form a fluid flow path which is capable of carrying out cooling effectively. The cold plate adopts a fin type micro-channel manner, so that the high-power cooling of a daughter board is ensured. The system adopts a rear IO architectural mode, so that the external and internal signal transfer processing is improved while the system heat is taken away, and the rear IO architectural mode is a novel architectural processing mode.

Description

technical field [0001] The invention belongs to the field of computer technology. Background technique [0002] At present, there are many types of liquid-cooled cold plates for cooling and heat dissipation. The inlet and outlet of the flow channel are in a straight-line state, such as a liquid-cooled cold plate with a composite casting structure disclosed in patent CN102548337, but in some special applications Occasionally, because the cold plate needs to be slotted to install the printed board and the height of the components on the printed board is considered, the inlet and outlet of the flow channel cannot be designed for DC, which has limitations in application. [0003] Currently used microchannel cold plates, such as a plate-fin welded electronic cold plate disclosed in patent CN201601941U and a cold plate for electronic components disclosed in patent CN202425269U, the design of the internal flow channel fins is continuous. In this design method, the fluid flow is re...

AI Technical Summary

Problems solved by technology

[0002] At present, there are many types of liquid-cooled cold plates for cooling and heat dissipation. The inlet and outlet of the flow channel are in a straight-line state, such as a liquid-cooled cold plate with a composite casting structure disclosed in patent CN102548337, but in some special applications Occasions Because the cold plate needs to be slotted to install the printed board and the height of the components on the printed board is considered, the flow channel entrance and exit cannot be designed for DC, which has application limitations.

[0003] Currently used microchannel cold plates, such as a plate-fin welded electronic cold plate disclosed in patent CN201601941U and a cold plate for electronic components disclosed in patent CN202425269U, the design of the internal flow channel fins is continuous. This design method is relatively stable when the fluid flows, and cannot form a turbulent flow state, the heat dissipation effect is not great, and the guide fin design of the fluid is not considered in the inlet and outlet ports

[0004] Currently used liquid-cooled chassis, such as a new type of high-efficiency cooling chassis and its heat dissipation method disclosed in patent CN103209553A, the flow channels between the modules are connected through the flow channel connectors, and there are redundant steps in this way , the degree of integrated design is not high; patent CN104125757A discloses a through-type chassis, the confluence and diversion of the flow channels of the liquid cooling plug-in are carried out through the flow channels in the chassis frame, through the liquid inlet cannula and the liquid outlet cannula The way in and out of the fluid is to directly pass the coolant into the liquid-cooled plug-in to take away the heat directly, but it ignores the effective treatment of the heat conducted by part of the liquid-cooled plug-in and the slot of the chassis. No liquid-cooled design is adopted; patent CN203482572U discloses a liquid-cooled chassis, the liquid flow path is a relatively simple U-shaped flow path, and the direction of the flow path is relatively single, and no heat dissipation solution is considered once the internal module generates a large amount of heat , is only the way to dissipate heat from the heat conduction to the side wall of the chassis through the fluid passing through the U-shaped flow channel

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