Grinding device and grinding method thereof

Abstract

The invention discloses a grinding device and a grinding method thereof. The grinding device comprises a bearing disc, at least one ground object, an abrasive disc and a plurality of grinding teeth. The bearing disc rotates; the at least one ground object is positioned on the bearing disc; the abrasive disc rotates relative to the bearing disc; the plurality of grinding teeth are connected with the abrasive disc; the plurality of grinding teeth grind the ground objects in a contact manner; each grinding tooth carries out the grinding operation on the surfaces of the ground objects to produce grinding areas; each grinding tooth intersects with corresponding virtual radioactive rays to form a grinding angle; and the virtual radioactive rays intersect with the center of the abrasive disc and the centers of the corresponding grinding teeth, and the grinding angle is greater than 0 degree and smaller than 35 degrees. According to the grinding device and the grinding method thereof, the special grinding angle cooperates with the corresponding parameters, so that the surfaces of the ground objects can produce relatively large grinding areas and are equivalent in grinding; moreover, chips can be successfully removed so as to reduce the variation of total thickness.

Description

technical field [0001] The invention relates to a grinding device and a grinding method thereof, in particular to a grinding device and a grinding method thereof which can reduce the total thickness variation of ground objects after grinding. Background technique [0002] Grinding is one of the most important steps in the manufacturing process or precision grinding industry. Generally, the commonly used grinding wheel base is combined with grinding teeth to form a grinding wheel set, and the grinding wheel set is connected to the grinding wheel rotating motor through the grinding wheel shaft for grinding operation. The grinding teeth correspond to the center of the grinding wheel base and are arranged radially. However, since the displacement direction of the grinding teeth is perpendicular to the extending direction of the grinding side of the grinding teeth, the debris of the object to be ground is easy to accumulate on the grinding side of the grinding teeth relative to t...

AI Technical Summary

Problems solved by technology

Although this structure is beneficial to the removal of debris, it often leads to insufficient uniformity of grinding performance and quality due to the small frictional contact area, resulting in too large total thickness variation (Total ThicknessVariation, TTV), which cannot meet the needs of manufacturers.

[0004] From the above, it can be seen that there is currently a lack of a grinding device and grinding method that can remove chips smoothly and reduce the variation in the total thickness of the ground material after grinding. Therefore, relevant companies are all looking for a solution.

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