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Electronic apparatus, image pickup module set and assembling method thereof

A camera module and assembly method technology, which is applied to branch office equipment, television, telephone communication, etc., can solve the problems of dust spots, adverse effects on the imaging quality of camera modules, and dust spots entering the motor, so as to improve assembly efficiency, Improving image quality and reducing assembly cost

Active Publication Date: 2017-11-28
TRULY OPTO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this process, when the lens is focused, it is necessary to rotate the lens to move relative to the motor. This process may not only cause the risk of dust spots due to the relative friction between the lens and the motor, but also cause dust spots from the external environment to enter the motor. Internal risks, these dust spots will have a negative impact on the imaging quality of the camera module

Method used

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  • Electronic apparatus, image pickup module set and assembling method thereof
  • Electronic apparatus, image pickup module set and assembling method thereof
  • Electronic apparatus, image pickup module set and assembling method thereof

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] The embodiment of the present application provides a camera module assembly method, such as figure 1 shown, including:

[0038] S101: providing a substrate, the surface of the substrate is bound with a photosensitive chip;

[0039] S102: Mount a supporting structure on the surface of the substrate having a photosensitive chip;

[0040] S103: Determine a preset distance according to the lens, where the preset distance is equal to the sum of the focal p...

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Abstract

The present invention discloses an electronic apparatus, an image pickup module set and an assembling method thereof. According to the assembling method of the image pickup module set, before a lens is screwed into a motor, a preset distance is determined according to the lens, a distance from the lens and the bottom surface of the motor is set to be the sum of the focal point of the motor and the thickness of a photosensitive chip during a process in which the lens is screwed into the motor, so that the focusing process of the motor is not required after the motor carrying the lens is mounted on a substrate, and therefore, the problem of dust spots in the focusing process can be avoided, and the imaging quality of the image pickup module set can be improved; and the assembling method of the image pickup module does not need to carry out a focusing process, the setting of a traditional focusing process position and the purchase of a focusing device can be canceled, and therefore, the assembling cost of the image pickup module set is greatly reduced, and the assembling efficiency of the image pickup module set is improved to a certain extent.

Description

technical field [0001] The present application relates to the technical field of camera equipment, and more specifically, to an electronic device, a camera module and an assembly method thereof. Background technique [0002] With the continuous development of electronic equipment, integrating a camera function in the electronic equipment has become a standard configuration of various electronic equipment. The camera module is an important component device for realizing the camera function, and its assembly process greatly affects the imaging quality and assembly efficiency of the camera module. [0003] Today's mainstream camera module assembly process generally includes: mounting circuit devices on the substrate, binding the photosensitive chip, mounting the support structure (Holder), mounting the motor screwed into the lens (Lens), soldering the motor to the substrate, aligning the lens After focusing and follow-up processing, it will be shipped. In this process, when f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H04M1/02
CPCH04M1/0264H04N23/50H04N23/57H04N23/55
Inventor 姚波刘自红
Owner TRULY OPTO ELECTRONICS