Hot-pressing buffer sheet and preparation method thereof

A buffer sheet and heat-conducting silica gel layer technology, applied in the field of buffer materials, can solve the problems of low tensile strength, breaking and pressing times, and low production efficiency, and achieve good heat resistance, long service life, and not easy to delaminate Effect

Inactive Publication Date: 2017-12-15
苏州中垒新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Hot pressing buffer sheet is mainly used in the process of LCD, LED, TCP Bonding, PCB (Printed Circuit Board) Bonding, PWB (Printed Wiring Board) Bonding, as a hot pressing buffer for anisotropic conductive film, (isotropic Orientation conductive film (a viscous film in which conductive particles are uniformly distributed), the purpose is to conduct the thermal head to the ACF at high temperature to soften it and produce an adhesive effect, and as a contact buffer material for the thermal head, the traditional thermal The pressure buffer material generally uses a heat-conducting silica gel sheet as the buffer material. Its disadvantage is that it is not easy to leave after high-pressure pressing, and it is easy to leave the silica gel on the product. Up to about 15 times, the production efficiency is low in the module and PCB process

Method used

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  • Hot-pressing buffer sheet and preparation method thereof

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Effect test

specific Embodiment 1

[0015] A kind of hot-press buffer sheet, this hot-press buffer comprises Teflon fiberglass cloth, adhesive and heat-conducting silica gel layer, and the thickness of described Teflon glass fiber cloth is 0.5mm, and width is 10mm, and Teflon glass fiber cloth The surface is coated with an adhesive, which forms an adhesive layer, and the adhesive is made of the following materials in mass fraction: 40% of silicone modified silicone resin, 40% of silane coupling agent, 10% of organic solvent and liquid temperature-resistant 10% of the liquid temperature-resistant agent is used to increase the temperature resistance of the finished product. The adhesive layer is provided with a thermally conductive silica gel layer. The thermally conductive silica gel layer is composed of 100% thermally conductive silica gel and 0.2% A / B Platinum vulcanizing agent, 20% conductive glue, 5% carbon nanotubes, nano titanium oxide and silica gel wetting agent are mixed and made.

[0016] A method for p...

specific Embodiment 2

[0021] A hot-pressed buffer sheet, the hot-pressed buffer includes Teflon glass fiber cloth, an adhesive and a heat-conducting silica gel layer, the thickness of the Teflon glass fiber cloth is 0.15-2.0 mm, and the width is 2-1350 mm. The surface of Long glass fiber cloth is coated with an adhesive, which forms an adhesive layer, and the adhesive is made of the following materials in mass fraction: 35% of organic silicon modified silicone resin, 35% of silane coupling agent, and 20% of organic solvent and liquid temperature-resistant agent 10%, the liquid temperature-resistant agent is used to increase the temperature resistance of the finished product, the adhesive layer is provided with a heat-conducting silica gel layer, and the heat-conducting silica gel layer is composed of 100% heat-conducting silica gel, 5% It is made by kneading double two four, 15% conductive powder, 2% carbon nanotubes, nano-titanium oxide and silica gel wetting agent.

[0022] A method for preparing...

specific Embodiment 3

[0027] A kind of hot-press buffer sheet, this hot-press buffer comprises Teflon glass fiber cloth, adhesive and heat-conducting silica gel layer, and the thickness of described Teflon glass fiber cloth is 2.0mm, and width is 500mm, Teflon glass fiber cloth The surface is coated with an adhesive, which forms an adhesive layer, and the adhesive is made of the following mass fraction materials: 35% silicone modified silicone resin, 35% silane coupling agent, 20% organic solvent and liquid temperature-resistant 10%, the liquid temperature-resistant agent is used to increase the temperature resistance of the finished product. The adhesive layer is provided with a heat-conducting silica gel layer. The heat-conducting silica gel layer is composed of 100% heat-conducting silica gel and 3% double , 30% conductive powder, 5% carbon nanotubes, nano-titanium oxide and silica gel wetting agent.

[0028] A method for preparing a heat-pressed buffer sheet, characterized in that it comprises ...

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Abstract

The invention discloses a hot-pressed buffer sheet and a preparation method thereof. The hot-pressed buffer sheet and the preparation method thereof comprise a Teflon glass fiber cloth, an adhesive and a heat-conducting silica gel layer, and the surface of the Teflon glass fiber cloth is coated with an adhesive , the adhesive forms an adhesive layer, and the adhesive is made of the following materials in mass fraction: 30-40% of organosilicon-modified silicon resin, 30-40% of silane coupling agent, 10-20% of organic solvent and liquid resistant 10-20% warming agent, and a heat-conducting silica gel layer is arranged on the adhesive layer, and the heat-conducting silica gel layer is composed of heat-conducting silica gel with a mass fraction of 100%, 0.2-3% A / B platinum vulcanizing agent or 1-5% bis Four or 1-5% double 25, 5-30% conductive adhesive or 5-30% conductive powder, 2-5% carbon nanotubes, nano-titanium oxide and silica gel wetting agent. Through the above method, the present invention has good heat resistance, conductivity and release property, is not easy to delaminate, and has a long service life.

Description

technical field [0001] The invention relates to buffer materials in LCD, LED, TCP Bonding, PCB Bonding, PWB Bonding and other manufacturing processes, in particular to a heat-pressed buffer sheet and a preparation method thereof. Background technique [0002] Hot pressing buffer sheet is mainly used in the process of LCD, LED, TCP Bonding, PCB (Printed Circuit Board) Bonding, PWB (Printed Wiring Board) Bonding, as a hot pressing buffer for anisotropic conductive film, (isotropic Orientation conductive film (a viscous film in which conductive particles are uniformly distributed), the purpose is to conduct the thermal head to the ACF at high temperature to soften it and produce an adhesive effect, and as a contact buffer material for the thermal head, the traditional thermal The pressure buffer material generally uses a heat-conducting silica gel sheet as the buffer material. Its disadvantage is that it is not easy to leave after high-pressure pressing, and it is easy to leave...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B17/06B32B25/10B32B25/20B32B25/08B32B27/30B32B7/12D06M10/02C09J183/04C08L83/04C08L27/18C08K3/22C08K7/24C08K7/14
CPCB32B5/02B32B7/12B32B25/08B32B25/10B32B25/20B32B27/304B32B2262/101B32B2307/306C08K3/22C08K7/14C08K7/24C08K2003/2241C08K2201/001C08K2201/011C08L2201/08C09J183/04D06M10/025
Inventor 贾忠杰
Owner 苏州中垒新材料科技有限公司
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