A segmented dehydrogenation method for packaged shells with copper material components
A packaging shell, segmented technology, applied in the field of packaging shell material processing, can solve the problems of difficult removal, decreased solderability, high hydrogen content, etc., and achieve the effect of low solderability of the coating
Active Publication Date: 2020-11-13
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Problems solved by technology
Moreover, the solubility of copper material itself to hydrogen is stronger than that of ordinary iron alloys, and some also show strong adsorption, so its hydrogen content is generally high, and it is difficult to remove
In addition, in the manufacture of shells, it is often necessary to plate Ni and Au layers at the end. If the plating layer is baked for a long time, its solderability will be greatly reduced and the subsequent assembly will be affected. The requirements of the package itself require low hydrogen content at the same time. Shell weldability is also good, it is very difficult
Method used
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[0054] Taking a mosaic shell with a size of 7.5mm×24mm, a thickness of 1.4mm, and a tungsten-copper base of 24mm×6mm and a thickness of 1.5mm as an example, this example does not limit any rights of the present invention in any way. Specific steps:
[0055] Step 1. Baking the shell after brazing and inlaying before plating, specifically:
[0056] a. Put the pattern into the furnace cavity and close the furnace door;
[0057] b. Carried out in a high vacuum brazing furnace, vacuumed to 10 -1 Start heating when it is below MPa;
[0058] c. Use the process curve as attached figure 1As shown, the heating rate is 10°C / min, the temperature is raised to 300°C and kept for 10 minutes, and then raised to 355°C at a rate of 5°C / min, kept for 42 hours, and the sample is taken out after cooling to below 60°C with the furnace, and the pre-plating baking is completed. ;
[0059] Step 2. The shell that has been baked before plating is further treated with nickel plating.
[0060] Step ...
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Abstract
The invention discloses a segmented dehydrogenation method for a packaging shell with copper material components, which specifically includes: a pre-plating baking process section, a plating baking process section and a post-plating baking process section. The three process sections formulated by the invention respectively remove the hydrogen introduced in the material and in the plating process in a targeted manner, and can achieve good results. By adopting the segmented hydrogen removal process parameters of the present invention, the hydrogen content of the shell of the copper-containing component can be strictly controlled below 2000ppm, and the influence on the weldability of the plating layer is small. The invention is suitable for various shells of copper-containing components, has strong operability, and takes into account the hydrogen content and weldability requirements of the shells, and has high practical value.
Description
technical field [0001] The invention relates to a segmented dehydrogenation method for a packaging shell of a copper material component, which is mainly used for controlling the hydrogen content of the packaging shell of a copper material component, and belongs to the technical field of packaging shell material processing. Background technique [0002] Copper materials, such as tungsten copper, molybdenum copper, oxygen-free copper and other copper and their alloys, play a very important role in the manufacture of packaging shells: they have high melting point, good machinability, and excellent thermal conductivity, and are often used as bases Important heat-conducting components such as heat sinks and heat sinks are inlaid on the shells of various high-power devices. [0003] However, copper materials generally show certain sensitivity to both hydrogen and oxygen, typically resulting in "hydrogen disease": Cu 2 O+H 2 ←→2Cu+H 2 O, the water vapor molecules produced by the...
Claims
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IPC IPC(8): C25D5/34C25D5/50C22F1/08C22F1/02C25D5/12
CPCC22F1/02C22F1/08C25D5/12C25D5/34C25D5/50
Inventor 申忠科王鲁宁刘思栋董一鸣
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD