Segmented hydrogen removing method of copper material module packing shell

Abstract

The invention discloses a segmented hydrogen removing method of a copper material module packing shell. The method specifically comprises a baking process section before plating, a baking process section during plating and a backing process section after plating. The three process sections remove hydrogen introduced in materials in the plating process in a targeted manner to achieve excellent effects. Segmented hydrogen removing process parameters are adopted to strictly control the tube-shell hydrogen contents of copper-contained modules below 2000 ppm; and the influence on weldability of plating layers is lower. The method is suitable for various copper-contained module shells and high in operability, gives attention to the hydrogen contents and the shell weldability requirements, and is higher in actual values.

Description

technical field [0001] The invention relates to a segmented dehydrogenation method for a packaging shell of a copper material component, which is mainly used for controlling the hydrogen content of the packaging shell of a copper material component, and belongs to the technical field of packaging shell material processing. Background technique [0002] Copper materials, such as tungsten copper, molybdenum copper, oxygen-free copper and other copper and their alloys, play a very important role in the manufacture of packaging shells: they have high melting point, good machinability, and excellent thermal conductivity, and are often used as bases Important heat-conducting components such as heat sinks and heat sinks are inlaid on the shells of various high-power devices. [0003] However, copper materials generally show certain sensitivity to both hydrogen and oxygen, typically resulting in "hydrogen disease": Cu 2 O+H 2 ←→2Cu+H 2 O, the water vapor molecules produced by the...

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Problems solved by technology

Moreover, the solubility of copper material itself to hydrogen is stronger than that of ordinary iron alloys, and some also show strong adsorption, so its hydrogen content is generally high, and it is difficult to remove

In addition, in the manufacture of shells, it is often necessary to plate Ni and Au layers at the end. If the plating layer is baked for a long time, its solderability will be greatly reduced and the subsequent assembly will be affected. The requirements of the package itself require low hydrogen content at the same time. Shell weldability is also good, it is very difficult

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