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Modulated thermal conductance thermal enclosure

A packaging and thermal insulation technology, applied to structural parts, electrical components, battery pack components, etc., can solve problems such as inability to maintain the device

Active Publication Date: 2018-01-09
HONEYWELL INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal insulators may not be able to keep these devices within their operating range in the face of such a wide range of ambient temperatures

Method used

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  • Modulated thermal conductance thermal enclosure
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Embodiment Construction

[0011] In the following description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustrations specific embodiments that may be practiced. These embodiments have been described in sufficient detail to enable those skilled in the art to practice the invention, and it will be understood that other embodiments may be utilized and structural, logical and and electrical changes. Accordingly, the following description of exemplary embodiments should not be read in a limiting sense, and the scope of the invention is defined by the appended claims.

[0012] Vacuum based thermal insulators provide the thermal resistance requirements for applications requiring thin insulation and can be manufactured in a wide range of custom profiles. In one embodiment, an improved high performance thermal package includes a feedback mechanism that modulates its thermal resistance based on ambient temperature. The thermal resistance is hig...

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Abstract

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap betweenthe plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposedin the gap.

Description

Background technique [0001] Conventional thermal insulation materials (e.g. polyisocyanurate, polystyrene, polyurethane) are not adequate for certain applications requiring thin, high performance thermal insulation (e.g. portable fuel cells) thermal resistance requirements. Vacuum-based thermal insulators, such as vacuum insulation panels, can meet the thermal performance requirements of these applications, but cannot be cost-effectively manufactured in custom shapes. [0002] Some devices, such as power supplies and sensors, must operate over a wide range of ambient temperatures. Thermal insulators may not be able to maintain these devices within their operating ranges in the face of such a wide range of ambient temperatures. Contents of the invention [0003] The thermal insulation device comprises: a first plate; a second plate formed to nest adjacent to the first plate with a gap between the first plate and the second plate; disposed in the gap between the plates a po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M2/10
CPCH01M2250/30H01M8/2475Y02B90/10Y02E60/50H01M8/04007H01M8/04067
Inventor S.J.埃克霍夫J.M.克莱因
Owner HONEYWELL INT INC