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Polishing pad dressing control method and device, dresser and polishing equipment

A control method and control device technology, applied in the field of polishing, can solve the problems of affecting CMP, shortening the service life of the polishing pad, and difficult to achieve the physical consistency of the polishing pad surface, so as to achieve the effect of prolonging the service life and good surface physical consistency

Active Publication Date: 2018-02-06
TSINGHUA UNIV +1
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, during the working process of chemical mechanical polishing equipment, due to the variety of products, the magnitude of the polishing pressure acting on different regions of the wafer is not the same. It is difficult to achieve the physical consistency of the surface of the polishing pad with a single sinusoidal speed mode. This will affect the CMP (Chemical Mechanical Polishing, chemical mechanical polishing) process and shorten the service life of the polishing pad

Method used

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  • Polishing pad dressing control method and device, dresser and polishing equipment
  • Polishing pad dressing control method and device, dresser and polishing equipment
  • Polishing pad dressing control method and device, dresser and polishing equipment

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Embodiment Construction

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0047] This application is based on the inventor's discovery and recognition of the following facts and problems:

[0048] In the chemical mechanical polishing mechanism, the physical characteristics of the polishing pad have a great influence on the CMP process. In the actual production process, the physical properties of the polishing pad will change with the use cycle. Therefore, in the chemical mechanical polishing equipment, the dresser installed on the swing arm is usually used to repair the polishing pad, which affects the repair ...

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Abstract

The invention discloses a polishing pad dressing control method and device, a dresser and polishing equipment. The polishing pad dressing control method includes the following steps that datum repairing pressure of the dresser is obtained; the datum weight coefficient of each repairing region in b repairing regions of a polishing pad is calculated; the current repairing region of the polishing padis obtained, and the actual weight coefficient of the current repairing region of the polishing pad is obtained; the actual repairing pressure of the current repairing region of the polishing pad iscalculated according to the datum repairing pressure and the datum weight coefficient and the actual weight coefficient of the current repairing region. According to the polishing pad dressing controlmethod, the polishing pad can be dynamically repaired in real time, surface physics uniformity of the polishing pad is achieved better, the service life of the polishing pad is prolonged, and the polishing pad dressing control method is simple and effective.

Description

technical field [0001] The present invention relates to the technical field of polishing, in particular, to a control method for dressing a polishing pad, a control device for dressing a polishing pad, a dresser with the control device for dressing the polishing pad, and a control device for dressing the polishing pad polishing equipment. Background technique [0002] In order to repair the polishing pad in real time and prolong the service life of the polishing pad, in the related art, force is generally applied to the dresser, and the dresser is made to move at a sinusoidal speed, so as to achieve the physical consistency of the surface of the polishing pad. [0003] However, during the working process of chemical mechanical polishing equipment, due to the variety of products, the magnitude of the polishing pressure acting on different regions of the wafer is not the same. It is difficult to achieve the physical consistency of the surface of the polishing pad with a single...

Claims

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Application Information

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IPC IPC(8): B24B53/017
CPCB24B53/017
Inventor 张敬业路新春沈攀王同庆
Owner TSINGHUA UNIV
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