Automatic clamping device for electronic component electroplating

Abstract

The invention discloses an automatic clamping device for electroplating of electronic components, comprising a base, a bearing is clamped on the upper surface of the base, a rotating shaft is sleeved inside the bearing, and a driven gear is clamped on the surface of the rotating shaft , the driven gear meshes with the driving device, and the lower surface of the driving device is fixedly connected with the upper surface of the base. The automatic clamping device for electroplating of electronic components, through the cooperation between the support plate, the sliding sleeve, the sliding rod, the connecting rod, the threaded cap, the threaded column and the biaxial motor, the worker first holds the electronic component by hand, so that the electronic component is located in the Between the two movable plates, at the same time, the double-axis motor is rotated forward by operating the control panel, so that the two sliding rods move closer to each other, so that the two movable plates move closer to each other. When the two movable plates clamp and fix the electronic components , the worker can release his hand, thereby making it more convenient for the worker to fix the electronic components, thereby improving the worker's work efficiency.

Description

technical field [0001] The invention relates to the technical field of electronic component processing, in particular to an automatic clamping device for electronic component electroplating. Background technique [0002] Electronic components are the basis of electronic products. Understanding the types, structures, and performance of commonly used electronic components and being able to choose them correctly are the basis for learning and mastering electronic technology. Commonly used electronic components are: resistors, capacitors, inductors, potentiometers, transformers, etc. In terms of installation methods, they can be divided into two categories: traditional installation (also known as through-hole installation or DIP) and surface installation (also known as SMT). or SMD). Transistors and diodes are called electronic devices. [0003] In the semiconductor industry, some types of electronic components need to be electroplated on the surface after being packaged. Befo...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an automatic clamping device for electroplating of electronic components, which solves the problem that most of the current methods of fixing electronic components are manually fixed by using hangers, which makes the operation of workers more troublesome. Thereby reducing the work efficiency of workers

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