Memory bank heat-dissipation device
A heat dissipation device and memory stick technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of memory stick performance degradation, shorten the service life of the memory stick, unfavorable memory stick ventilation, etc., and achieve extended use The effect of improving the lifespan and improving the ventilation and cooling performance
Pending Publication Date: 2018-04-17
丙申南京网络技术有限公司
View PDF3 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In electronic products such as computers, multiple memory sticks are usually installed side by side on the chassis. However, the space between every two memory sticks is too small, which is not conducive to the ventilation of the memory sticks. After a long time, the performance of the memory sticks will decrease and shorten Memory lifespan
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0017] In order to make the technical solutions of the present invention clearer and clearer to those skilled in the art, the present invention will be further described in detail below in conjunction with the examples and accompanying drawings, but the embodiments of the present invention are not limited thereto.
[0018] Such as figure 1 and figure 2 As shown, a heat dissipation device for a memory stick provided in this embodiment includes a first heat dissipation element 12 and a second heat dissipation element 14, and the first heat dissipation element 12 and the second heat dissipation element 14 are arranged in sequence along the air flow 50 direction. In the memory stick 20, the first heat sink 12 includes two first heat sinks 122 symmetrically arranged along the memory stick 20, and the second heat sink 14 includes two second heat sinks 142 symmetrically arranged along the memory stick 20 A plurality of ventilation fins 145 are respectively provided on the inner sid...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a memory bank heat-dissipation device, belonging to the technical field of purlines. The memory bank heat-dissipation device comprises a first heat-dissipation component and asecond heat-dissipation component, wherein the first heat-dissipation component and the second heat-dissipation component are sequentially arranged in a memory bank along the air flow direction; the first heat-dissipation component comprises first heat-dissipation pieces which are symmetrically arranged along the memory bank; the second heat-dissipation component comprises second heat-dissipationpieces which are symmetrically arranged along the memory bank; and a plurality of venting pieces are respectively arranged on the inner side surfaces of the two heat-dissipation pieces, and one ends of the venting pieces are arranged on the outer side surfaces of the two first heat-dissipation pieces. By arranging the second heat-dissipation component at the rear part of the memory bank or the first heat-dissipation component, the temperature accumulated at the rear part of the memory bank can be intensively reduced, so that the venting and cooling properties of the memory bank are improved, and the service life of the memory bank is correspondingly prolonged.
Description
technical field [0001] The present invention relates to a heat dissipation device, in particular to a memory stick heat dissipation device, which belongs to the technical field of heat dissipation devices. Background technique [0002] With the rapid development of modern technology, the demand for memory increases, the storage capacity and frequency of memory sticks continue to increase, and the heat generated during the working process also increases accordingly. How to dissipate heat from memory sticks during use has become more and more important . In electronic products such as computers, multiple memory sticks are usually installed side by side on the chassis. However, the space between every two memory sticks is too small, which is not conducive to the ventilation of the memory sticks. After a long time, the performance of the memory sticks will decrease and shorten Memory lifespan. Contents of the invention [0003] The main purpose of the present invention is to...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 陈磊杨云峰季宇哲
Owner 丙申南京网络技术有限公司