Flexible array substrate and preparation method thereof, display substrate and display device

A flexible array and array substrate technology, which is applied in the fields of nonlinear optics, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., can solve problems such as broken signal lines and reduced yield of display devices

Active Publication Date: 2018-04-20
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since a large number of signal lines are arranged in the non-display area 10, the signal lines are likely to be broken during the bending process, which in turn leads to a decrease in the yield of the display device.

Method used

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  • Flexible array substrate and preparation method thereof, display substrate and display device
  • Flexible array substrate and preparation method thereof, display substrate and display device
  • Flexible array substrate and preparation method thereof, display substrate and display device

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] An embodiment of the present invention provides a flexible array substrate, such as figure 2 As shown, it includes a non-display area 10 and a display area 20 , the non-display area 10 includes a bending area 01 adjacent to the display area 20 , wherein signal lines 11 are arranged in the non-display area 10 .

[0037] Those skilled in the art should understand that the above-mentioned signal line does not absolutely mean that the signal line is only l...

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PUM

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Abstract

The embodiment of the invention provides a flexible array substrate and a preparation method thereof, a display substrate and a display device, and relates the technical field of display. The probability of fracture of the signal lines in the bonding area caused by bonding can be reduced. The flexible array substrate comprises a display area and a non-display area. The non-display area comprises the bonding area adjacent to the display area. The bonding area comprises the signal lines and auxiliary lines which are arranged on the underlying substrate, and the auxiliary lines are arranged on one side back to the underlying substrate of the signal lines. The area of the insulating layer in which the bonding area is overlapped with different signal lines is provided with different concave part groups formed by multiple concave parts which are arranged along the extension direction of different signal lines, and the auxiliary lines cover the concave part groups.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a flexible array substrate and a preparation method, a display substrate, and a display device. Background technique [0002] Flexible display devices are more and more used in wearable devices, electronic paper and other fields in recent years because of their lightness, lightness, and bendability. Among them, in the prior art, the backplane in the flexible display device is generally bent The area is bent to achieve the effect of narrow frame or no frame of the flexible display device. [0003] Specifically, such as figure 1 As shown, the flexible display device includes a non-display area 10 and a display area 20. The non-display area 10 has a bending area 01 (Bonding Area) at a position close to the display area 20. Generally, the entire non-display area 10 is bonded along the bending area 01. towards the back of the display device (i.e. the non-display side, figu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1218H01L27/1244H01L27/1248H01L27/1259G02F1/133305G02F1/136286G02F2201/42Y02E10/549G02F1/136272H10K59/1315H10K59/1795H10K77/111H01L27/1262G02F1/1333H10K59/12
Inventor 张帅
Owner BOE TECH GRP CO LTD
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