LED device, LED lamp and method for processing conductive wire of LED device

Abstract

The invention discloses an LED device, which comprises an LED chip, a bracket and a conductive wire, wherein the conductive wire is of a three-dimensional structure and comprises a vertical section, an obliquely upwards inclining first stress buffer section, an obliquely downwards inclining second stress buffer section and an obliquely downwards inclining third stress buffer section which are sequentially arranged; a first transitional bending section is formed between the vertical section and the first stress buffer section, a second transitional bending section is formed between the first stress buffer section and the second stress buffer section, a third transitional bending section is formed between the second stress buffer section and the third stress buffer section, the first transitional bending section, the second transitional bending section and the third transitional bending section are sequentially arranged along a length direction of the conductive wire; and the second transitional bending section and the third transitional bending section are opposite in bending direction; and one end of the conductive wire is used for being connected with the LED chip, and the other end of the conductive wire is used for being connected with the bracket or another LED chip. The invention further discloses an LED lamp and a method for processing the conductive wire of the LED device. The reliability of the LED device disclosed by the invention is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an LED device, an LED lamp and a method for processing conductive wires of the LED device. Background technique [0002] The LED device in the prior art installs the chip through the bracket, and the bracket is provided with two electrical connection areas arranged at intervals, and an insulating area is between the two electrical connection areas, and the LED chip is installed in one of the electrical connection areas, and through the conductive The wire is electrically connected to another electrical connection area, so as to realize the conduction of the LED chip. After the installation of the conductive wire is completed, the bracket needs to be covered with encapsulation gel, and the LED chip and the conductive wire are covered by the encapsulation gel. [0003] Among them, the conductive wires in the prior art generally have a two-dimensional structure, that is, the ...

AI Technical Summary

Problems solved by technology

There are two ways to reduce the arc height C2. The first method is to reduce the height C1 of the vertical section of the conductive welding wire (that is, the first distance from the LED chip electrode to the arc) while ensuring the included angle B1 and the degree of camber of the arc. The height of an inflection point), when the height C1 of the vertical section is less than the length of the HAZ (heat response zone) of the welding wire, the connection point D between the vertical section and the solder ball will become very fragile, and its reliability will be reduced , it is difficult to meet the requirements; the second method is to increase the J angle, but when the J angle increases, the included angle B1 of the line arc will become smaller. In addition, when the camber of the line arc becomes larger, the top of the line arc It will press down. At this time, C2≤C1 may occur, that is, the burden on point D, the connection point between the vertical section and the solder ball, will be increased, resulting in weakened reliability.

[0007] Similarly, if the conductive bonding wire used to connect two LED chips and the conductive bonding wire used to connect the LED chip and the electrical connection area where the LED chip is located also use the above-mentioned J-wire arc, it will also have the above-mentioned problems, such as The Chinese utility model patent with the notification number CN206388703 discloses that the top of the conductive welding wire turns to one side, and the angle of the turning determines the height of the conductive welding wire and the position of the first bending section and the second bending section. The angle formed by the horizontal plane, and in the process of reducing the arc height, it is also easy to appear that the height of the vertical section is less than the length of the HAZ (heat response zone) of the welding wire

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