a board set
A board set and board technology, which is applied in the computer field, can solve the problems of water accumulation in the cold plate flow channel, the accumulation of water cannot be drawn out, and the single cold plate cannot be effectively distributed and flowed in the working state, so as to achieve effective heat dissipation. Effect
Active Publication Date: 2019-12-03
SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST
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Problems solved by technology
[0005] (1) The flow of the fluid will be too dependent on the external pump. If there are multiple cold plates in the system, the fluid working state of a single cold plate will not be able to effectively distribute the flow;
[0006] (2) If the system is running, it is necessary to verify the heat dissipation capacity of a single cold plate, which cannot be verified;
[0008] (4) Once the cold plate is stopped during use, there will be water in the flow channel of the cold plate, and the accumulated water in the flow channel cannot be pumped out
Method used
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Embodiment Construction
[0028] Such as figure 1 As shown, the board card according to an embodiment of the present invention includes a board card body 9 and a liquid-cooled cold plate, and the liquid-cooled cold plate is used to dissipate heat from the board card body 9 .
[0029] The liquid-cooled cold plate includes an inlet fluid connector 2, a pump 4, a serpentine flow channel 7 provided on the cold plate 6, and an outlet fluid connector 8 connected in sequence. Runner 7.
[0030] The pump 4 can be used for self-pressurization, so as to compensate the pressure loss of the fluid passing through the liquid inlet fluid connector 2, the serpentine flow channel 7 and the liquid outlet fluid connector 8, so as to increase the fluid flow rate and further improve the heat dissipation efficiency of the cold plate.
[0031] The pump 4 is a small gas-liquid pump, which is convenient for each liquid-cooled cold plate to be equipped with a pump, such as the SWB-80D series gas-liquid small pump of Siwei Boos...
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The invention provides a liquid-cooling cold rolled plate which comprises an input fluid connector, a pump, a cold rolled plate and an output fluid connector, wherein the pump is used to accelerate the fluid to flow into the cold rolled plate. The invention also provides a board and a board set. According to the liquid-cooling cold rolled plate, board and board set, the mini pump is integrated onthe liquid-cooling cold rolled plate, heat radiation of each board is not dependent on an external pump, and heat of the board can be taken away effectively; the rotating speed of the pump of the liquid-cooling cold rolled plate can be controlled independently according to the status of each board via such structure, and effective heat radiation is ensured further; and via the mini pump integratedon the liquid-cooling cold rolled plate, water accumulated in a channel in the liquid-cooling cold rolled plate can be exhausted via effect of air pressure after work.
Description
technical field [0001] The invention relates to the technical field of computers, in particular to a board set. Background technique [0002] In the field of computer technology applications, electronic circuit boards generate a lot of heat when they are working, and using liquid-cooled cold plates to dissipate heat is currently a mainstream trend to solve the heat dissipation of electronic circuit board products. [0003] However, the cold plate heat dissipation method currently used is mainly to install the board card and the cold plate on the wall, and through the action of an external pump, the liquid cooling source liquid flows through the cold plate flow channel to dissipate the heat generated by the chips on the printed board. carried away by the flow of fluid. [0004] However, this approach has the following disadvantages: [0005] (1) The flow of the fluid will be too dependent on the external pump. If there are multiple cold plates in the system, the fluid worki...
Claims
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IPC IPC(8): H05K7/20F28D1/03
CPCF28D1/03H05K7/20H05K7/20509
Inventor 金旸霖
Owner SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST