Manufacturing method of curved frequency selective surface array

Abstract

The invention relates to the technical field of FSS (Frequency Selective Surface) radome manufacturing, and specifically discloses a manufacturing method of a curved frequency selective surface array.The manufacturing method comprises the steps of S1, respectively performing three-dimensional modeling on a substrate dielectric shell and a three-dimensional exposure mask shell through three-dimensional modeling software; S2, respectively inputting a substrate dielectric shell model and a three-dimensional exposure mask shell module into 3D printing equipment for molding; S3, coating the outersurface of the substrate dielectric shell with a photoresist, attaching the three-dimensional exposure mask shell to the molded substrate dielectric shell, enabling the two layers to be tightly laminated, and performing exposure processing through exposure equipment; S4, performing development processing, cleaning and drying on the substrate dielectric shell; and S5, preparing a metal film layer on the surface of the processed substrate dielectric shell, and removing the left photoresist by using a photoresist removing liquid, cleaning and drying. The manufacturing method not only can manufacture a hole unit array, but also can manufacture a patch unit array, and has good universality.

Description

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AI Technical Summary

Benefits of technology

This patented technology allows for creation of curled fused silicon (FSC) structures without being restricted from their complicated geometry or requiring expensive equipment like lithography techniques. It also enables production of various types of FSFAs such as microstrip lines, strips, spiral waveguides, etc., while maintaining flexibility over large areas. Additionally, it provides an improved way to make these materials on different surfaces through direct printing processes instead of traditional photolithographic pattern formation steps. Overall, this process offers technical benefits including increased efficiency, customization options, reduced costs associated therewith, enhanced performance capabilities, and easier implementation across multiple industries' needs.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the design flexibility and applicability of FSS surfaces due to their ability to filter out unwanted signals from targets without affecting their operation or functionality. Current methods require complicated processes like lamination onto flat substrate layers, thermal plasma spray coating, laser etching, solvent casting, electroforming, mechanical milling, molding, welding, bonding, gluing, and others, making them difficult to apply within specific types of target curvatures.

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