Packaging method of integrated packaging LED display module and LED display module

Abstract

The invention provides a packaging method of an integrated packaging LED display module. The method includes the following steps that the front face of a to-be-packaged unit plate faces downward and is fixed on an upper die of a hot-pressing mold located in a vacuum chamber; LED packaging adhesive films are placed on a lower die of the hot-pressing mold; heating and die assembling are carried outon the hot-pressing mold, so that the thickness of the laminated LED packaging adhesive films is 0.3-0.5 mm, and the lamination timing is not less than 50 s; the upper die and lower die of the hot-pressing mold are controlled to separate, and the packaged unit plate is taken down. The packaging method of the integrated packaging LED display module has the advantages that the cost can be saved, theefficiency and the reliability are improved, purpose-made LED packaging adhesive films are matched with hot-pressing mold sets to use, so that the consistent thickness, color and light transmittanceof the packaging colloid can be realized, and the structural packaging of the packaging colloid is realized. The packaging method can be applied to realize vacuum hot-pressing packaging of large-areaLED integrated packaging products, it is ensured that molded products do not have bulking deformation, and the reliability and superior splicing performance of the products are guaranteed.

Description

technical field [0001] The invention belongs to the technical field of LED display, and relates to a packaging method for an integrated packaging LED display module and the LED display module. Background technique [0002] In recent years, with the development of LED indoor display technology, indoor small-pitch LED display products have become the preferred choice of indoor display because of their clear display effect, high color saturation, seamless splicing and other technical advantages. Mainstream, gradually replacing and replacing DLP, LCD and other splicing technologies currently on the market. In order to achieve a smaller dot pitch, a more reliable packaging effect, and combine factors such as cost. How to achieve simple packaging of LED display screens, and obtain good display effects and low-cost packaging has become a subject of increasing concern in the industry. [0003] As far as the current LED indoor small-pitch display technology is concerned, packaging ...

AI Technical Summary

Problems solved by technology

Due to the protective performance of discrete components and the influence of reflow soldering in the subsequent m

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