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A kind of pressing method of mixed pressing plate

A hybrid, core board technology, used in multilayer circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as warpage of finished boards, reduce expansion and shrinkage, stabilize expansion and shrinkage, and improve warpage.

Active Publication Date: 2019-07-26
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for laminating mixed laminated boards to solve the problem of serious warping of finished boards when different materials are used for mixed pressing of existing printed circuit boards

Method used

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  • A kind of pressing method of mixed pressing plate
  • A kind of pressing method of mixed pressing plate
  • A kind of pressing method of mixed pressing plate

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Embodiment Construction

[0024] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0025] This embodiment provides a pressing method for mixed pressing boards, such as figure 1 shown, including

[0026] S10: Prepare n first core boards and 1 second core board, the expansion and shrinkage ratio of the first core board is greater than that of the second core board, the thickness of the first core board is smaller than the thickness of the second core board, n is a positive integer greater than or equal to 2.

[0027] It should be noted that in this embodiment, the first core board uses FR4 board, and the second core board uses high-frequency board. By setting the high-frequency board with excellent performance on the outer layer and the ordinary FR4 board on the middle layer, the electronic The electrical and thermal requirements of components can also reduce the preparation cost ...

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Abstract

The invention relates to the field of a printed circuit board, and particularly discloses a lamination method of a mixed lamination board. The lamination method comprises the following steps: S10. preparing n first core boards and a second core board, wherein the expansion and contraction ratio of the first core boards is greater than that of the second core board, the thickness of the first coreboard is less than that of the second core board, n is a positive integer which is greater than or equal to 2; S20. performing first-time lamination to n first core boards, to obtain x sub-boards, wherein x is a positive integer which is greater than or equal to 1; and S30. performing second-time lamination to the x sub-boards and the second core board, wherein the second core board is positionedat the uppermost layer. A finished board is obtained by firstly performing first-time lamination to the first core board with large expansion and contraction ratio to obtain one or a plurality of sub-boards and then performing second-time lamination to all the obtained sub-boards and the second core board with small expansion and contraction ratio, the lamination method adopting two-time lamination can obviously improve the warping problem of the mixed lamination board compared with the direct lamination to all the first core board and the second core board completely.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a pressing method for mixed pressing boards. Background technique [0002] At present, in order to meet the development needs of high integration, miniaturization, and miniaturization of electronic products, and on the premise of satisfying the good electrical and thermal performance of electronic products, circuit boards are also developing towards thinner and shorter trends, so as to reduce circuit boards. The size and overall thickness of the board substrate. This means that plates with better material properties need to be used to replace traditional plates in order to meet the electrical and thermal performance requirements of electronic products. [0003] For example, ordinary FR4 material is a plate made of ordinary epoxy resin and glass fiber cloth, which has low price and general performance. High-frequency material is a kind of material that mainly uses PTFE mater...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4626H05K3/4688H05K2203/068H05K2203/1476
Inventor 郑英东王水娟
Owner GUANGDONG SHENGYI SCI TECH
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