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Heat dissipation module for magnetron and magnetron having same

A technology of heat dissipation components and magnetrons, applied in the field of magnetrons, which can solve the problems of poor heat dissipation, underutilization, and restrictions on the width and height of heat sink components, so as to achieve good heat dissipation, miniaturization and high power the effect of

Pending Publication Date: 2018-08-10
GUANGDONG WITOL VACUUM ELECTRONICS MFR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The cooling method of the magnetron is usually air cooling, and the actual heat dissipation effect is closely related to the size of the heat sink. With the development of miniaturization of the magnetron, the magnetron heat sink assembly in the related art has the following problems: the heat sink assembly The width and height of the magnetron are limited, and the cold air is excited by the fan and enters the magnetron heat sink assembly. Because there is an area in the magnetron that the heat sink assembly cannot reach, the cold air in this area directly passes through the magnetron and is not fully utilized. Low utilization, resulting in poor heat dissipation

Method used

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  • Heat dissipation module for magnetron and magnetron having same
  • Heat dissipation module for magnetron and magnetron having same
  • Heat dissipation module for magnetron and magnetron having same

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Embodiment Construction

[0044] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0045]In describing the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular o...

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Abstract

The present invention discloses a heat dissipation module for a magnetron and a magnetron having the same. The heat dissipation module comprises: an intermediate cooling fin; an upper cooling fin arranged above the intermediate cooling fin and arranged with the intermediate cooling fin at intervals in a vertical direction, wherein the left side of the upper cooling fin is towards the left and is obliquely extended upwards, and the right side of the upper cooling fin is towards the right and is obliquely extended upwards; and a lower cooling fin arranged below the intermediate cooling fin and arranged with the intermediate cooling fin at intervals in a vertical direction, wherein the left side of the lower cooling fin is towards the left and is obliquely extended downwards, the right side of the lower cooling fin is towards the right and is obliquely extended downwards, and the intermediate cooling fin, the upper cooling fin and the upper cooling fin are respectively provided with coaxial anode holes. The heat dissipation module for a magnetron can fully utilize the heat dissipation space and the cold wind of the magnetron to have a good heat dissipation effect and facilitate miniaturization and high power of the magnetron.

Description

technical field [0001] The invention relates to the technical field of magnetrons, in particular to a heat dissipation assembly for a magnetron and a magnetron with the same. Background technique [0002] The cooling method of the magnetron is usually air cooling, and the actual heat dissipation effect is closely related to the size of the heat sink. With the development of miniaturization of the magnetron, the magnetron heat sink assembly in the related art has the following problems: the heat sink assembly The width and height of the magnetron are limited, and the cold air is excited by the fan and enters the magnetron heat sink assembly. Because there is an area in the magnetron that the heat sink assembly cannot reach, the cold air in this area directly passes through the magnetron and is not fully utilized. The utilization rate is low, resulting in poor cooling effect. Contents of the invention [0003] The present invention aims to solve at least one of the technica...

Claims

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Application Information

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IPC IPC(8): H01J23/00H01J25/50
CPCH01J23/005H01J25/50
Inventor 陈文
Owner GUANGDONG WITOL VACUUM ELECTRONICS MFR
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