Cleaning liquor, cleaning equipment and cleaning process for silicon chip

A technology for cleaning silicon wafers and cleaning fluids, applied in detergent compositions, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as unfavorable energy saving and environmental protection, high dirty chip rate, and loss of production enterprises, and achieve improvement Cleaning effect, improve cleaning quality, and save cleaning cost

Inactive Publication Date: 2018-08-24
INNER MONGOLIA ZHONGHUAN SOLAR MATERIAL
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AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the photovoltaic industry, the market competition is becoming increasingly fierce. The traditional silicon wafer cleaning process usually uses steps such as pure water pre-cleaning, cleaning liquid cleaning, and rinsing. However, the surface of the silicon wafer after this traditional process is cleaned. Cleaning liquid rema...

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  • Cleaning liquor, cleaning equipment and cleaning process for silicon chip

Examples

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Embodiment Construction

[0033] This example is a cleaning solution for silicon wafers, including potassium hydroxide solution with a concentration of 45% and hydrogen peroxide solution with a concentration of 31%, wherein the volume ratio of the potassium hydroxide solution to the hydrogen peroxide solution is 1:4.75.

[0034] A silicon wafer cleaning equipment, comprising an ultrasonic cleaning section composed of tanks 1, 2, 3, 4, 5, 6, 7, 8, 9 and 11, and a chemical cleaning section, the first rinsing section, the cleaning liquid cleaning section, the second rinsing section and the slow pulling section, wherein,

[0035] Tank 1 is the ultrasonic cleaning part, which is cleaned by an ultrasonic cleaning tank. The ultrasonic cleaning tank is pure water to pre-clean the silicon wafer. The ultrasonic cleaning tank is an overflow tank. The cleaning time is 160s, and the cleaning temperature is 45 ° C. Silica powder for removing particles;

[0036] The 2-4 tanks form the chemical cleaning part, which i...

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Abstract

The invention provides a cleaning liquor for a silicon chip. The cleaning liquor contains a potassium hydroxide liquor with concentration being 45% and a hydrogen peroxide liquor with concentration being 31%, wherein the volume ratio of the potassium hydroxide liquor to the hydrogen peroxide liquor is 1:1.05-1:7.25. Cleaning equipment for the silicon chip comprises an ultrasonic cleaning part usedfor removing granular silicon powder; a chemical cleaning part used for removing grease, metal ions and organic impurities, a first rinsing part used for removing chemical remaining on the surface ofthe silicon chip, a cleaning liquor cleaning part used for removing organic matter with the cleaning liquor for the silicon chip, a second rinsing part used for removing the cleaning liquor remainingon the surface of the silicon chip as well as a slow pulling part used for removing water on the surface of the silicon chip, so that water stains do not remain on the surface of the silicon chip. The invention further provides a cleaning process for the silicon chip on the basis of the cleaning equipment. The cleaning liquor, the cleaning equipment and the cleaning process for the silicon chip have the beneficial effects that the silicon chip surface cleaning effect is improved, cleaning efficiency and cleaning quality are improved, cleaning cost is saved, inspection proves that dirty chip rate is reduced obviously, and texture surface of the silicon chip is uniform and free of dirt after texture etching.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer production, and in particular relates to a silicon wafer cleaning liquid, cleaning equipment and a cleaning process. Background technique [0002] With the rapid development of the photovoltaic industry, the market competition is becoming increasingly fierce. The traditional silicon wafer cleaning process usually uses steps such as pure water pre-cleaning, cleaning liquid cleaning, and rinsing. However, the surface of the silicon wafer after this traditional process is cleaned. Cleaning liquid remains, and the rate of dirty chips is high, which leads to a certain increase in the rate of poor staining in the subsequent cashmere making, causing great losses to the production enterprise. In addition, during the cleaning process, energy consumption is high, and cleaning liquid is wasted seriously, which is not conducive to Energy saving and environmental protection. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): C11D7/06C11D3/39C11D7/60B08B3/12B08B3/08
Inventor 王冬雪王永青崔伟郝勇侯建明张宇鹏刘茂峰李娜赵越
Owner INNER MONGOLIA ZHONGHUAN SOLAR MATERIAL
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