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Carrier substrate and method of removing adhesive layer from carrier substrate

A technology for carrying substrates and adhesive layers, which is applied in the field of removing adhesive layers and carrying substrates, and can solve problems such as high production costs and low production speeds

Active Publication Date: 2020-05-12
MIRLE AUTOMATION CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, removing the adhesive layer manually will make the production cost high and the production speed too low

Method used

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  • Carrier substrate and method of removing adhesive layer from carrier substrate
  • Carrier substrate and method of removing adhesive layer from carrier substrate
  • Carrier substrate and method of removing adhesive layer from carrier substrate

Examples

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Embodiment Construction

[0027] The following is a specific example to illustrate the implementation of the "carrier substrate and method for removing the adhesive layer from the carrier substrate" disclosed in the present invention. Those skilled in the art can understand the advantages and disadvantages of the present invention from the content disclosed in this specification. effect. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not described in advance according to the actual size. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the technical scope ...

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Abstract

The instant disclosure provides a carrier substrate and a method for removing an adhesive layer from the carrier substrate. The carrier substrate has a first surface for carrying at least a material substrate, a second surface for adhering an adhesive layer and a recess space for suspending a picking portion of the adhesive layer. The first and second surfaces are opposite to each other and the recess space is formed from the second surface. The adhesive layer can be removed easily from the carrier substrate based on the structural design of the carrier substrate.

Description

technical field [0001] The present invention relates to a carrying substrate and a method for removing an adhesive layer, in particular to a carrying substrate for carrying a material substrate and a method for removing the adhesive layer from the carrying substrate. Background technique [0002] In the prior art, in order to meet the requirements of the manufacturing process, it is generally necessary to arrange the material substrate on the carrier substrate for processing of the material substrate. In addition, when the carrier substrate is carrying the material substrate or performing other manufacturing processes, temporary fixing materials such as an adhesive layer may be attached. When the adhesive layer needs to be removed from the carrier substrate, currently the adhesive layer is torn off manually. [0003] However, manually removing the adhesive layer will result in high production cost and low production speed. In response to the development of industrial autom...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B69/00
CPCB65B69/0025
Inventor 黄政毅陈音佑
Owner MIRLE AUTOMATION CORPORATION