External expansion bus filter for electrostatic protection, system on chip and electrostatic protection method
A filter and bus technology, applied in the field of low-voltage embedded control system or power electronics, can solve the problems of weak anti-interference ability, restricting the development of the industry, and high maintenance costs, so as to achieve communication data accuracy resistance, improve system stability, and avoid The effect of frequent reboots
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Embodiment 1
[0038] This embodiment provides a filter.
[0039] The filter is suitable for connecting to the external expansion bus to filter out low-frequency ripple interference.
[0040] In this embodiment, since there are many and dense signal lines, the filter can use several ceramic chip capacitors connected to the ground, such as but not limited to 25V 0402 ceramic chip capacitors, each ceramic chip capacitor is suitable for The bypass is at each connection of the bus; and the capacitance value of each ceramic chip capacitor is 27pF-100pF.
[0041] The electrostatic test of this filter is carried out by using the system on chip, the principle block diagram of the system on chip is shown in figure 1 As shown, in the system on chip, the interference signal is mainly spatially radiated to the expansion bus, the source and propagation channel of the interference signal cannot be changed, and no good method has been found to eliminate the interference signal in the prior art.
[0042] ...
Embodiment 2
[0048] On the basis of Embodiment 1, Embodiment 2 provides a system on chip.
[0049] See figure 1 , the system on chip includes: a main control core board and a function expansion board; wherein the main control core board is suitable for connecting with the function expansion board through its built-in bus external expansion circuit, and the external expansion bus of the external expansion circuit of the bus There are filters on them.
[0050] The filter may be the filter described in Embodiment 1. For the specific parameter setting of this filter, please refer to Embodiment 1 for details, and will not be repeated here.
[0051] see Figure 2a to Figure 4 , the bus external expansion circuit includes: first and second isolation modules connected to the processor module; wherein the first isolation module is suitable for isolating data information, and the second isolation module is suitable for address information and The control information is isolated; each ceramic chip...
Embodiment 3
[0056] On the basis of Embodiment 1 and Embodiment 2, this embodiment also provides an electrostatic protection method.
[0057] Specifically, a filter is connected to the bus external expansion circuit in the main control core board to filter out low-frequency ripple interference.
[0058] The filter may be the filter described in Embodiment 1. For the specific parameter setting of this filter, please refer to Embodiment 1 for details, and will not be repeated here.
[0059] The bus external expansion circuit includes: first and second isolation modules; wherein the first isolation module is suitable for isolating data information, and the second isolation module is suitable for isolating address information and control information; each The ceramic chip capacitors are respectively connected to the output ends of the first and second isolation modules, so as to perform low-frequency filtering on each channel of data information, each channel of address information and each ch...
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