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Processing device

A technology for processing devices and processed objects, which is applied in metal processing, electrical components, circuits, etc., can solve problems such as chuck workbench damage, and achieve the effect of preventing damage

Active Publication Date: 2021-06-04
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, in the processing apparatus as described above, although the angle and position of the chuck table are adjusted, the chuck table may be damaged.

Method used

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Embodiment Construction

[0024] An embodiment of one embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view schematically showing a configuration example of a cutting device (processing device) 2 according to the present embodiment. Such as figure 1 As shown, the cutting device 2 has a base 4 that supports each structure. A storage area 6 for storing a workpiece 11 is provided on the front side of the upper surface of the base 4 . The storage area 6 stores a plurality of workpieces 11 in a stacked state.

[0025] figure 2 It is a perspective view schematically showing a structural example of the workpiece 11 . The workpiece 11 is, for example, a package substrate formed in a rectangular plate shape in plan view. The front surface 11a side of the workpiece 11 is composed of a plurality of planned long-side dividing lines (spacer lanes) 13a extending along the long-side direction D1 and a plurality of short-side dividing lines (space...

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Abstract

A processing device is provided to prevent damage to the chuck table. The processing device has: a chuck table for holding the workpiece held by the holding surface; a processing unit for processing the workpiece held by the chuck table; and a control unit for controlling each structural element. The control unit has : A judging unit that judges that the chuck table is relatively moved to the workpiece in such a manner that the planned division line on the long side of the workpiece overlaps with the tool relief groove on the long side of the chuck table. When the angle and position of the table relative to the workpiece are adjusted, whether the short-side planned dividing line overlaps with the short-side tool undercut; and the notification unit determines that it is the short-side planned dividing line If it does not overlap with the tool undercut on the short side, the operator is notified of the fact.

Description

technical field [0001] The present invention relates to a processing device for processing a plate-shaped workpiece represented by a package substrate. Background technique [0002] When dividing a package substrate in which a plurality of device chips are sealed with resin into packaged device chips corresponding to each device chip, for example, a cutting device is used in which a ring-shaped cutting blade is attached to a spindle as a rotation axis. In this application, a dedicated chuck table designed to match a package substrate to be divided is often installed in a cutting device (for example, refer to Patent Document 1). [0003] The above-mentioned chuck table has: a relief groove for a cutting tool corresponding to a planned dividing line (separation lane) of the package substrate; and a plurality of suction holes for sucking each area of ​​the package substrate divided by the planned dividing line. , so that the chuck table can directly hold the package substrate....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26D7/20B26D5/00B26D7/01B26D7/06B26D7/32H01L21/67
CPCH01L21/67092H01L21/67253B26D5/00B26D7/018B26D7/06B26D7/20B26D7/32H01L21/6838H01L21/68764H01L21/67242H01L21/78H01L21/76
Inventor 加藤圭佐胁悟志佐藤雅史
Owner DISCO CORP
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