Separation method of flexible panel
A flexible panel and separation method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of poor separation uniformity, reduced separation yield, and low production efficiency, so as to simplify the separation process and improve the separation yield Effect
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[0013] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0014] see figure 1 , is a schematic diagram of the first working state of the flexible panel separation method of the present invention. The flexible panel 20 is bonded to the first substrate 10 , and the first substrate 10 is separated from the flexible panel 20 by generating sound waves through the vibration generator 30 .
[0015] The flexible panel 20 includes:
[0016] A second substrate 21 bonded to the first substrate 10;
[0017] a switching element 22 disposed on a surface of the second substrate 21 away from the first substrate 10;
[0018] a light emitting layer 23 covering the switching element 22; and
[0019] An encapsulation layer 24 covering the light emitting layer 23 .
[0020] The vibration sound generator 30 is provided at least one, and is provided near the bonding place of the first substrate 10 and the second substrate 21 ...
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