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Separation method of flexible panel

A flexible panel and separation method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of poor separation uniformity, reduced separation yield, and low production efficiency, so as to simplify the separation process and improve the separation yield Effect

Active Publication Date: 2020-07-03
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because this method requires high-energy laser beam scanning, the production efficiency is low, the uniformity of separation is poor, and it is easy to cause damage to the flexible panel during the peeling process, thereby reducing the separation yield.

Method used

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  • Separation method of flexible panel
  • Separation method of flexible panel
  • Separation method of flexible panel

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Experimental program
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Embodiment Construction

[0013] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0014] see figure 1 , is a schematic diagram of the first working state of the flexible panel separation method of the present invention. The flexible panel 20 is bonded to the first substrate 10 , and the first substrate 10 is separated from the flexible panel 20 by generating sound waves through the vibration generator 30 .

[0015] The flexible panel 20 includes:

[0016] A second substrate 21 bonded to the first substrate 10;

[0017] a switching element 22 disposed on a surface of the second substrate 21 away from the first substrate 10;

[0018] a light emitting layer 23 covering the switching element 22; and

[0019] An encapsulation layer 24 covering the light emitting layer 23 .

[0020] The vibration sound generator 30 is provided at least one, and is provided near the bonding place of the first substrate 10 and the second substrate 21 ...

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PUM

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Abstract

The invention discloses a method for separating a flexible panel, which uses a vibrating sounder to generate sound waves to separate the first substrate from the flexible panel. Through the above method, the invention can simplify the separation process while protecting the flexible panel from damage, and improve the separation efficiency. yield.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for separating a flexible panel. Background technique [0002] At present, flexible OLED (Organic Light-Emitting Diode, organic light-emitting diode) technology mostly attaches flexible substrates such as PI, PET or metal foil to rigid substrates such as glass substrates, and then performs related processes for OLED preparation on flexible substrates. After the preparation is completed, the flexible substrate and the rigid substrate are peeled off. With the development of industrial technology, LLO (laser lift off, laser separation) technology has been widely applied to the field of flexible OLED display. Usually, after the display device is prepared, a high-energy laser beam is used to scan the back of the display device, so that the flexible panel and the rigid The adhesive between the substrates ages and the adhesion performance decreases, and then the flexible pane...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56
CPCH10K71/80
Inventor 陶强
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD