The invention discloses a preparation method of a diamond/copper composite high in heat conduction performance. The preparation method comprises the following steps of 1, uniformly mixing diamond obtained after surface of the diamond is subjected to degreasing and roughening treatment with tungsten powder according to the mass ratio of 1: 4.5, heating a powder mixture under the vacuum condition, conducting heat preservation for 2-8 hours at the temperature of 1030 DEG C, and finally, separating out modified tungsten-plated diamond, wherein the vacuum degree is 10<-2>-10<-4> Pa, and the temperature rising rate is 5 DEG C/min; and 2, uniformly mixing the tungsten-plated diamond, with the mean particle size being 125 microns, obtained after surface modification with copper powder with the mean particle size being 45 microns with the total volume content of the tungsten-plated diamond accounting for 55%, sintering an obtained powder mixture, and then cooling the obtained power mixture to the room temperature, so that the diamond/copper composite is obtained, wherein the sintering parameters are that the pressing pressure is 40 MPa, the temperature is 1000 DEG C, the temperature risingrate is 100 DEG C/min, the sintering time is 10 minutes, and the atmosphere is vacuum.