Flexible membrane liner and substrate separation process for producing flexible display device

Abstract

The invention discloses a flexible membrane liner and substrate separation process for producing a flexible display device. The process includes the steps: (1) producing a flexible membrane liner on a carrier substrate, and treating the juncture of the flexible membrane liner and the carrier substrate to enable some regions to become high-adhesion regions and the rest region to become a low-adhesion region; (2) producing an electronic component on the flexible membrane liner over the low-adhesion region; (3) cutting vertically and downwardly from the flexible membrane liner along the periphery of the electronic component to form a cutting line, wherein the low-adhesion region is located under the cutting line; (4) separating the flexible membrane liner from the carrier substrate. The flexible membrane liner is stably attached to the carrier substrate in the subsequent device production process, and the process is simple in liner and substrate separation, low in cost and rapid and causes no damage to the device.

Description

technical field [0001] The invention relates to the field of preparation of flexible display devices, in particular to a process for separating a flexible film substrate and a substrate for the preparation of flexible display devices. Background technique [0002] In the preparation of flexible display devices, a flexible thin film substrate is first formed on a hard substrate, and then electronic devices are fabricated on the flexible thin film substrate, and finally the flexible thin film substrate is separated from the substrate to obtain a finished device without the substrate. However, this method in the prior art has some defects: flexible substrates and substrates need to withstand harsh experimental conditions such as ion bombardment, chemical corrosion, ultraviolet radiation, and high-temperature treatment during the subsequent preparation of electronic devices, resulting in the substrate The adhesion between the substrate and the substrate is greatly improved, and ...

AI Technical Summary

Problems solved by technology

However, this method in the prior art has some defects: flexible substrates and substrates need to withstand harsh experimental conditions such as ion bombardment, chemical corrosion, ultraviolet radiation, and high-temperature treatment during the subsequent preparation of electronic devices, resulting in the substrate The adhesion between the substrate and the substrate is greatly improved, and it is very easy to damage the flexible substrate film and the electronic devices on it when the flexible film substrate is detached from the hard substrate; on the contrary, if the flexible film substrate and the hard substrate If the adhesion is too weak, there will be a problem of accidental detachment of the flexible film substrate during the fabrication of the device.

Nevertheless, the balance of adhesion is still difficult to control, and it is even more difficult to find a separation process suitable for various experiments and production environments

Images