Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of diamond/copper composite high in heat conduction performance

A composite material and diamond technology, which is applied in the field of diamond/copper composite material preparation, can solve the problems of low bonding strength between diamond and copper matrix, low diamond protection effect, and difficult separation of diamond, so as to ensure the intrinsic thermal conductivity The effect of shortening the sintering cycle and shortening the sintering time

Active Publication Date: 2018-04-17
ZHENGZHOU UNIV
View PDF10 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of this invention is to provide a kind of preparation method of diamond / copper composite material with high thermal conductivity, which has solved the problem that the bonding strength of diamond and copper substrate in the existing preparation method is not high, the protective effect on diamond is not high, and the tungsten after tungsten plating Diamond separation is difficult, the process is complicated and cumbersome, the preparation cycle is long, and the product performance is unstable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of diamond/copper composite high in heat conduction performance
  • Preparation method of diamond/copper composite high in heat conduction performance
  • Preparation method of diamond/copper composite high in heat conduction performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The diamond particles and tungsten powder after degreasing and roughening treatment on the surface are mixed evenly according to the mass ratio of 1:4.5-5, and the mixed powder is heated under vacuum conditions, and kept at 1025°C-1035°C for 2-8h, the vacuum degree 10 -2 -10 -4 Pa, the heating rate is 5-6°C / min, and finally the modified tungsten-coated diamond particles are separated;

[0028] After surface modification, tungsten-coated diamond particles with an average particle size of 120 μm-130 μm are mixed evenly with copper powder with an average particle size of 30 μm-46 μm according to the volume content of 50%-60% of the total volume, and the obtained mixed powder is sintered. Sintering parameters: The pressing pressure is 20 MPa-40MPa, the temperature is 900°C-1050°C, the heating rate is 50-100°C / min, the sintering time is 5min-15min, the atmosphere is vacuum, and then cooled to room temperature with the furnace to obtain the diamond / copper composite material....

Embodiment 2

[0031] Mix diamond particles with an average particle size of 125 μm and tungsten powder with an average particle size of 0.3 μm in a mass ratio of 1:4.5, place the mixed powder in an alumina porcelain boat, and then place the porcelain boat in a vacuum furnace to heat, 1030 ℃ for 2 hours, with a vacuum of 10 -2 -10 -4 Pa, the heating rate is 5°C / min, and finally the modified tungsten-coated diamond particles are separated by a sample sieve.

[0032] The tungsten-coated diamond particles with an average particle size of 126 μm are mixed with copper powder with an average particle size of 45 μm according to the volume content of 55% of the total volume, and the resulting mixed powder is put into a spark plasma sintering furnace for sintering. Sintering parameters: pressing The pressure is 40MPa, the temperature is 1000°C, the heating rate is 100°C / min, the holding time is 10min, the atmosphere is vacuum, and then the diamond / copper composite material can be obtained by cooling...

Embodiment 3

[0035] Mix diamond particles with an average particle size of 125 μm and tungsten powder with an average particle size of 0.3 μm in a mass ratio of 1:4.5, place the mixed powder in an alumina porcelain boat, and then place the porcelain boat in a vacuum furnace to heat, 1030 ℃ for 2 hours, with a vacuum of 10 -2 -10 -4 Pa, the heating rate is 5°C / min, and finally the modified tungsten-coated diamond particles are separated by a sample sieve.

[0036]The tungsten-coated diamond particles with an average particle size of 126 μm are mixed with copper powder with an average particle size of 45 microns according to the volume content of 60% of the total volume, and the resulting mixed powder is put into a spark plasma sintering furnace for sintering. Sintering parameters: pressing The pressure is 40MPa, the temperature is 1000°C, the heating rate is 100°C / min, the holding time is 10min, the atmosphere is vacuum, and then the diamond / copper composite material can be obtained by coo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a preparation method of a diamond / copper composite high in heat conduction performance. The preparation method comprises the following steps of 1, uniformly mixing diamond obtained after surface of the diamond is subjected to degreasing and roughening treatment with tungsten powder according to the mass ratio of 1: 4.5, heating a powder mixture under the vacuum condition, conducting heat preservation for 2-8 hours at the temperature of 1030 DEG C, and finally, separating out modified tungsten-plated diamond, wherein the vacuum degree is 10<-2>-10<-4> Pa, and the temperature rising rate is 5 DEG C / min; and 2, uniformly mixing the tungsten-plated diamond, with the mean particle size being 125 microns, obtained after surface modification with copper powder with the mean particle size being 45 microns with the total volume content of the tungsten-plated diamond accounting for 55%, sintering an obtained powder mixture, and then cooling the obtained power mixture to the room temperature, so that the diamond / copper composite is obtained, wherein the sintering parameters are that the pressing pressure is 40 MPa, the temperature is 1000 DEG C, the temperature risingrate is 100 DEG C / min, the sintering time is 10 minutes, and the atmosphere is vacuum.

Description

technical field [0001] The invention belongs to the technical field of preparing high thermal conductivity composite materials, in particular to a preparation method of high thermal conductivity diamond / copper composite materials. Background technique [0002] With the development of the electronic industry and high-density packaging technology, the operating temperature of the circuit continues to rise, resulting in the traditional packaging materials can no longer meet its performance requirements. In the field of microelectronics, every 10°C decrease in junction temperature can double the service life of a chip. Therefore, the preparation of electronic packaging materials with high thermal conductivity and low thermal expansion coefficient is the key to the rapid development of the electronics industry. [0003] Common metal materials such as Cu and Al, although their thermal conductivity is as high as 398W / (m·k), their thermal expansion coefficients are too different fr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C26/00C22C1/05C22C1/10B22F1/02B22F3/105
CPCC22C1/05C22C26/00B22F3/105B22F1/17
Inventor 王海龙闫建明张珂皓邵刚许红亮卢红霞范冰冰王溢仁张锐
Owner ZHENGZHOU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com