The invention discloses a preparation method of
a diamond /
copper composite high in heat conduction performance. The preparation method comprises the following steps of 1, uniformly mixing
diamond obtained after surface of the
diamond is subjected to
degreasing and roughening treatment with
tungsten powder according to the
mass ratio of 1: 4.5, heating a
powder mixture under the vacuum condition, conducting heat preservation for 2-8 hours at the temperature of 1030 DEG C, and finally, separating out modified
tungsten-plated
diamond, wherein the vacuum degree is 10<-2>-10<-4> Pa, and the temperature rising rate is 5 DEG C / min; and 2, uniformly mixing the
tungsten-plated diamond, with the mean particle size being 125 microns, obtained after
surface modification with
copper powder with the mean particle size being 45 microns with the total
volume content of the tungsten-plated diamond accounting for 55%,
sintering an obtained
powder mixture, and then cooling the obtained power mixture to the
room temperature, so that the diamond /
copper composite is obtained, wherein the
sintering parameters are that the pressing pressure is 40 MPa, the temperature is 1000 DEG C, the temperature risingrate is 100 DEG C / min, the
sintering time is 10 minutes, and the
atmosphere is vacuum.