4results about How to "Clean interface" patented technology

An integrated cleaning and liquid supply device and online cleaning method for polyurethane polishing pads are disclosed. The device includes a base, a rotating seat, a swing arm, an independent liquid supply pipeline system and cleaning pipeline, a high-pressure nozzle array, and a positioning sensor assembly. During the polishing stage, polishing liquid is dripped through the liquid supply outlet. During the cleaning stage, the swing arm moves centripetally to a preset position aligned with the center of the polishing pad. The positioning sensor triggers a high-pressure pump, causing pure water to be sprayed as an atomized jet along the diameter of the pad surface through the high-pressure nozzle array. Simultaneously, the polishing pad rotates at a low speed, utilizing the synergistic effect of centrifugal force and high-pressure water flow to thoroughly remove residual contaminants within the micropores of the polyurethane. This invention integrates liquid supply and deep cleaning functions into the same motion mechanism, eliminating the need for machine shutdown or manual intervention. It offers advantages such as non-contact, non-destructive, thorough cleaning, and high automation, extending the life of the polishing pad and improving the stability of the CMP process.

The application belongs to the technical field of copper-based diamond composite materials, and particularly relates to a diamond copper-based composite material and a preparation method thereof. The preparation method comprises the following steps: mixing modified diamond powder and copper powder by ball milling, and obtaining a diamond copper core material after hot-pressing sintering; activating the diamond copper core material, then magnetron sputtering a Ni / Pr alloy target material onto the upper and lower surfaces of the activated diamond copper core material to form a Ni / Pr composite intermediate layer; vacuum welding copper sheets on the upper and lower surfaces of the Ni / Pr composite intermediate layer to obtain the diamond copper-based composite material. The diamond copper-based composite material prepared by the application has high density, excellent thermal conductivity, low thermal expansion coefficient and is convenient to process.

The application discloses a preparation method of an impact-resistant non-uniform hard alloy, and the method takes tungsten carbide powder with a particle size of 0.6-0.8 microns and tungsten carbide powder with a particle size of 2-2.5 microns as main raw materials, and is additionally provided with cobalt powder as a binder phase, and is further combined with grain inhibitors such as tantalum carbide, chromium carbide and yttrium oxide to inhibit abnormal growth of fine crystal regions in a sintering process, so as to ensure the stability and high hardness of the fine crystal structure of the bearing substrate, and to form a Zener pinning effect to mechanically hinder the migration of the grain boundary, further refine and stabilize the structure, purify the interface and strengthen the phase combination, and solve the problems of the existing hard alloy, such as difficult consideration of strength and toughness, easy fragmentation under high-speed impact load, sharp performance degradation caused by interface weakening in a high-temperature environment and the like.

This invention relates to the field of electrochemical energy storage materials and lithium metal battery technology, specifically to an in-situ polymerized solid electrolyte, its preparation method and application, and lithium metal batteries. This in-situ polymerized solid electrolyte is prepared by heating a ring-opening polymerization reaction using 1,3-dioxolane and 1,1,1-trifluoro-2,3-epoxypropane as reactants, sodium thiosulfate as an initiator, and lithium salt and plasticizer fluoroethylene carbonate as a precursor solution. This electrolyte possesses numerous amorphous regions, which is beneficial for ion transport, enabling the formation of a self-supporting dense structure. It also ensures close contact with the electrode, resulting in a pure interface that effectively reduces interfacial impedance and avoids side reactions at the electrode interface. Furthermore, it enhances oxidation resistance, broadens the electrochemical window, and inhibits dendrite growth. While achieving good mechanical properties, it also improves the cycle stability and safety performance of the battery. It has excellent application prospects in lithium metal batteries, lithium-ion batteries, solid-state energy storage systems, or flexible electronic devices.