Diffusion bonding method for high-temperature alloy and oxygen-free copper annular part

A high-temperature alloy and diffusion bonding technology, which is applied in welding equipment, metal processing equipment, electron beam welding equipment, etc., can solve the problems of peeling of the connecting layer, high porosity of the connecting layer, and layered matrix, so as to avoid peeling and increase the application range effect

Inactive Publication Date: 2018-09-18
BEIHANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When connecting dissimilar materials between superalloys and oxygen-free copper, using traditional welding, brazing, and direct diffusion welding methods

Method used

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  • Diffusion bonding method for high-temperature alloy and oxygen-free copper annular part
  • Diffusion bonding method for high-temperature alloy and oxygen-free copper annular part
  • Diffusion bonding method for high-temperature alloy and oxygen-free copper annular part

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Embodiment Construction

[0022] The method for diffusion bonding of superalloys and oxygen-free copper rings provided by the present invention will be described in detail below with reference to the accompanying drawings and specific examples.

[0023] Such as figure 1 — Figure 5 As shown, the superalloy provided by the present invention and the oxygen-free copper ring diffusion bonding method include

[0024] The following steps in order:

[0025] 1) According to the structural features of the superalloy and oxygen-free copper ring connectors 4 and 5, the superalloy ring 3 is prepared. The material of the superalloy ring 3 is GH907, which is prepared by mechanical processing, the surface is polished, and the surface is ultrasonically cleaned with acetone.

[0026] 2) Design and process a reasonable oxygen-free copper sheath according to the thickness of the oxygen-free copper layer and the shape of the connector. The sheath includes the top plate 1 and the U-shaped cylinder 2. The thickness of th...

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PUM

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Abstract

The invention provides a diffusion bonding method for a high-temperature alloy and oxygen-free copper annular part. The diffusion bonding method comprises the steps of preparation of the annular part,preparation of a sleeve, assembly, hot isostatic pressing pretreatment, hot isostatic pressing process control and post-processing. According to the diffusion bonding method for the high-temperaturealloy and oxygen-free copper annular part, the hot isostatic pressure diffusion bonding technology is adopted, the oxygen-free copper and the high-temperature alloy annular part form diffusion bondingunder the condition of high temperature and high pressure, and the high-temperature alloy and oxygen-free copper annular part is formed. According to the diffusion bonding method for the high-temperature alloy and oxygen-free copper annular part, the problems of spalling, block dropping and delamination of a connecting layer and the problem of matrix separation are avoided, the porosity of the connecting layer is reduced, and good metallurgical bonding is achieved.

Description

technical field [0001] The invention belongs to the field of aerospace manufacturing, and in particular relates to the aspect of diffusion connection between a superalloy and an oxygen-free copper ring. Background technique [0002] High-temperature alloys have excellent high-temperature strength, good oxidation resistance, thermal corrosion resistance, creep resistance, fatigue performance, fracture toughness and other comprehensive properties, and are widely used in the aerospace field. In recent years, a large number of high-temperature alloys with low expansion coefficients have been selected in China to make annular parts for turbine engines, such as high-pressure compressor rear casings, bearing rings, heat insulation rings, combustion chamber sealing rings, honeycomb seats and Turbine outer ring, etc.; and rocket engine thrust combustor, exhaust duct and header box, etc. [0003] When connecting dissimilar materials between superalloys and oxygen-free copper, using t...

Claims

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Application Information

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IPC IPC(8): B23K20/02B23K20/24B23K28/02B23K15/00
CPCB23K15/00B23K20/021B23K20/023B23K20/24B23K28/02
Inventor 郎利辉徐文才黄西娜李世越肖毅
Owner BEIHANG UNIV
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